TMS320VC5507 datasheet(105/108 Pages) TI1

номер детали	TMS320VC5507

подробное описание детали	Fixed-Point Digital Signal Processor

PDF	108 Pages

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производитель	TI1 [Texas Instruments]

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SM320VC5507-EP

www.ti.com

SPRS613 – SEPTEMBER 2009

Mechanical Data

6.1

Package Thermal Resistance Characteristics

Table 6-1 and Table 6-2 provide the estimated thermal resistance characteristics for the SM320VC5507

DSP package types.

Table 6-1. Thermal Resistance Characteristics (Ambient)

PACKAGE

RΘJA (°C/W)

BOARD TYPE (1)

AIRFLOW (LFM)

71.2

High–K

61.8

High–K

150

58.9

High–K

250

54.8

High–K

500

PGE

103.6

Low–K

84.2

Low–K

150

77.8

Low–K

250

69.4

Low–K

500

(1)

Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package

Thermal Measurements.

Table 6-2. Thermal Resistance Characteristics (Case)

PACKAGE

RΘJA (°C/W)

BOARD TYPE (1)

PGE

13.8

2s JEDEC Test Card

(1)

Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package

Thermal Measurements.

6.2

Packaging Information

The following packaging information reflects the most current released data available for the designated

device(s). This data is subject to change without notice and without revision of this document.

Mechanical Data

105

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