TMS320VC5507 datasheet(3/108 Pages) TI1

3 / 108 page

SM320VC5507-EP

www.ti.com

SPRS613 – SEPTEMBER 2009

5.2.1

Recommended Operating Conditions for CVDD = 1.2 V (108 MHz) ..................................... 59

5.2.2

Recommended Operating Conditions for CVDD = 1.35 V (144 MHz) .................................... 60

5.2.3

Recommended Operating Conditions for CVDD = 1.6 V (200 MHz) ..................................... 61

5.3

ELECTRICAL CHARACTERISTICS

.................................................................................... 62

5.3.1

Electrical Characteristics Over Recommended Operating Case Temperature Range for CVDD =

1.2 V (108 MHz) (Unless Otherwise Noted)

................................................................ 62

5.3.2

Electrical Characteristics Over Recommended Operating Case Temperature Range for CVDD =

1.35 V (144 MHz) (Unless Otherwise Noted)

............................................................... 63

5.3.3

Electrical Characteristics Over Recommended Operating Case Temperature Range for CVDD =

1.6 V (200 MHz) (Unless Otherwise Noted)

................................................................ 64

5.4

ESD Performance

......................................................................................................... 65

5.5

Timing Parameter Symbology

........................................................................................... 65

5.6

Clock Options

.............................................................................................................. 66

5.6.1

Internal System Oscillator With External Crystal

........................................................... 66

5.6.2

Layout Considerations

......................................................................................... 66

5.6.3

Clock Generation in Bypass Mode (DPLL Disabled)

...................................................... 67

5.6.4

Clock Generation in Lock Mode (DPLL Synthesis Enabled)

.............................................. 68

5.6.5

Real-Time Clock Oscillator With External Crystal

.......................................................... 69

5.7

Memory Interface Timings

................................................................................................ 70

5.7.1

Asynchronous Memory Timings

.............................................................................. 70

5.7.2

Synchronous DRAM (SDRAM) Timings

..................................................................... 72

5.8

Reset Timings

.............................................................................................................. 79

5.8.1

Power-Up Reset (On-Chip Oscillator Active)

............................................................... 79

5.8.2

Power-Up Reset (On-Chip Oscillator Inactive)

............................................................. 80

5.8.3

Warm Reset

..................................................................................................... 80

5.9

External Interrupt Timings

................................................................................................ 81

5.10

Wake-Up From IDLE

...................................................................................................... 82

5.11

XF Timings

................................................................................................................. 82

5.12

General-Purpose Input/Output (GPIOx) Timings

...................................................................... 83

5.13

TIN/TOUT Timings (Timer0 Only)

....................................................................................... 84

5.14

Multichannel Buffered Serial Port (McBSP) Timings

................................................................. 85

5.14.1

McBSP0 Timings

............................................................................................... 85

5.14.2

McBSP1 and McBSP2 Timings

............................................................................... 86

5.14.3

McBSP as SPI Master or Slave Timings

.................................................................... 89

5.14.4

McBSP General-Purpose I/O Timings

....................................................................... 94

5.15

Enhanced Host-Port Interface (EHPI) Timings

........................................................................ 95

5.16

2C Timings

................................................................................................................ 101

5.17

Universal Serial Bus (USB) Timings

................................................................................... 103

5.18

ADC Timings

.............................................................................................................. 104

Mechanical Data

.............................................................................................................. 105

6.1

Package Thermal Resistance Characteristics

....................................................................... 105

6.2

Packaging Information

................................................................................................... 105

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