TMS320VC5507 datasheet(57/108 Pages) TI1

номер детали	TMS320VC5507

подробное описание детали	Fixed-Point Digital Signal Processor

PDF	108 Pages

Scroll/Zoom	100%

производитель	TI1 [Texas Instruments]

домашняя страница	http://www.ti.com

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57 / 108 page

PREFIX

TMS 320 VC 5507

GHH

TMX = Experimental device

TMP = Prototype device

TMS = Qualified device

SMJ = MIL-STD-883C

= High Rel (non-883C)

DEVICE FAMILY

320 = TMS320 family

TECHNOLOGY

PACKAGE TYPE †‡§

GHH

= 179-terminal plastic BGA

ZHH

= 179-terminal plastic BGA with Pb-free

soldered balls

PGE

= 144-pin plastic LQFP

VC = Dual-Supply CMOS

DEVICE

55x DSP: 5507

† BGA =

Ball Grid Array

LQFP =

Low-Profile Quad Flatpack

‡ The ZHH mechanical package designator representsthe version of the GHH with PbFree soldered balls. The ZHH package

devices are supported in the same speed grades as the GHH package devices (available upon request ).

§ For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the

TI website (www.ti.com).

SM320VC5507-EP

www.ti.com

SPRS613 – SEPTEMBER 2009

Information regarding TI DSP products is also available on the Worldwide Web at http://www.ti.com

uniform resource locator (URL).

4.3

TMS320VC5507 Device Nomenclature

Figure 4-1. Device Nomenclature for the TMS320VC5507

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