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MPC8540 датащи(PDF) 69 Page - Freescale Semiconductor, Inc

номер детали MPC8540
подробное описание детали  MPC8540 PowerQUICC III??Integrated Host Processor Reference Manual
PDF  1302 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
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MPC8540 датащи(HTML) 69 Page - Freescale Semiconductor, Inc

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MPC8540 PowerQUICC III Integrated Host Processor Reference Manual, Rev. 1
Freescale Semiconductor
lxix
Tables
Table
Number
Title
Page
Number
13-5
Memory Bank Sizes in Relation to Address Mask ............................................................. 13-13
13-6
ORn—GPCM Field Descriptions ....................................................................................... 13-14
13-7
ORn—UPM Field Descriptions .......................................................................................... 13-16
13-8
ORn—SDRAM Field Descriptions .................................................................................... 13-18
13-9
MAR Field Description....................................................................................................... 13-19
13-10
MxMR Field Descriptions................................................................................................... 13-19
13-11
MRTPR Field Descriptions ................................................................................................. 13-22
13-12
MDR Field Description....................................................................................................... 13-22
13-13
LSDMR Field Descriptions ................................................................................................ 13-23
13-14
LURT Field Descriptions .................................................................................................... 13-25
13-15
LSRT Field Descriptions..................................................................................................... 13-25
13-16
LTESR Field Descriptions .................................................................................................. 13-26
13-17
LTEDR Field Descriptions.................................................................................................. 13-27
13-18
LTEIR Field Descriptions ................................................................................................... 13-29
13-19
LTEATR Field Descriptions................................................................................................ 13-30
13-20
LTEAR Field Descriptions.................................................................................................. 13-30
13-21
LBCR Field Descriptions.................................................................................................... 13-31
13-22
LCRR Field Descriptions.................................................................................................... 13-32
13-23
GPCM Write Control Signal Timing for LCRR[CLKDIV] = 4 or 8.................................. 13-40
13-24
GPCM Read Control Signal Timing for LCRR[CLKDIV] = 4 or 8................................... 13-41
13-25
GPCM Write Control Signal Timing for LCRR[CLKDIV] = 2 ......................................... 13-42
13-26
GPCM Read Control Signal Timing for LCRR[CLKDIV] = 2 .......................................... 13-43
13-27
Boot Bank Field Values after Reset .................................................................................... 13-51
13-28
SDRAM Interface Commands ............................................................................................ 13-53
13-29
UPM Routines Start Addresses........................................................................................... 13-64
13-30
RAM Word Field Descriptions ........................................................................................... 13-69
13-31
MxMR Loop Field Use ....................................................................................................... 13-74
13-32
UPM Address Multiplexing ................................................................................................ 13-75
13-33
Data Bus Requirements For Read Cycle............................................................................. 13-89
13-34
Micron SDRAM Devices.................................................................................................... 13-91
13-35
LADn Signal Connections to 128-Mbyte SDRAM ............................................................ 13-93
13-36
Logical Address Bus Partitioning ....................................................................................... 13-94
13-37
SDRAM Device Address Port during Address Phase ........................................................ 13-94
13-38
SDRAM Device Address Port during READ/WRITE Command...................................... 13-94
13-39
Register Settings for 128-Mbytes SDRAMs....................................................................... 13-95
13-40
Logical Address Partitioning .............................................................................................. 13-96
13-41
SDRAM Device Address Port During Address Phase........................................................ 13-96
13-42
SDRAM Device Address Port During READ/WRITE Command..................................... 13-96
13-43
Register Settings for 512-Mbyte SDRAMs ........................................................................ 13-96
13-44
SDRAM Capacitance .......................................................................................................... 13-99



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