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MPC8540 датащи(PDF) 69 Page - Freescale Semiconductor, Inc |
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MPC8540 датащи(HTML) 69 Page - Freescale Semiconductor, Inc |
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69 / 1302 page ![]() MPC8540 PowerQUICC III Integrated Host Processor Reference Manual, Rev. 1 Freescale Semiconductor lxix Tables Table Number Title Page Number 13-5 Memory Bank Sizes in Relation to Address Mask ............................................................. 13-13 13-6 ORn—GPCM Field Descriptions ....................................................................................... 13-14 13-7 ORn—UPM Field Descriptions .......................................................................................... 13-16 13-8 ORn—SDRAM Field Descriptions .................................................................................... 13-18 13-9 MAR Field Description....................................................................................................... 13-19 13-10 MxMR Field Descriptions................................................................................................... 13-19 13-11 MRTPR Field Descriptions ................................................................................................. 13-22 13-12 MDR Field Description....................................................................................................... 13-22 13-13 LSDMR Field Descriptions ................................................................................................ 13-23 13-14 LURT Field Descriptions .................................................................................................... 13-25 13-15 LSRT Field Descriptions..................................................................................................... 13-25 13-16 LTESR Field Descriptions .................................................................................................. 13-26 13-17 LTEDR Field Descriptions.................................................................................................. 13-27 13-18 LTEIR Field Descriptions ................................................................................................... 13-29 13-19 LTEATR Field Descriptions................................................................................................ 13-30 13-20 LTEAR Field Descriptions.................................................................................................. 13-30 13-21 LBCR Field Descriptions.................................................................................................... 13-31 13-22 LCRR Field Descriptions.................................................................................................... 13-32 13-23 GPCM Write Control Signal Timing for LCRR[CLKDIV] = 4 or 8.................................. 13-40 13-24 GPCM Read Control Signal Timing for LCRR[CLKDIV] = 4 or 8................................... 13-41 13-25 GPCM Write Control Signal Timing for LCRR[CLKDIV] = 2 ......................................... 13-42 13-26 GPCM Read Control Signal Timing for LCRR[CLKDIV] = 2 .......................................... 13-43 13-27 Boot Bank Field Values after Reset .................................................................................... 13-51 13-28 SDRAM Interface Commands ............................................................................................ 13-53 13-29 UPM Routines Start Addresses........................................................................................... 13-64 13-30 RAM Word Field Descriptions ........................................................................................... 13-69 13-31 MxMR Loop Field Use ....................................................................................................... 13-74 13-32 UPM Address Multiplexing ................................................................................................ 13-75 13-33 Data Bus Requirements For Read Cycle............................................................................. 13-89 13-34 Micron SDRAM Devices.................................................................................................... 13-91 13-35 LADn Signal Connections to 128-Mbyte SDRAM ............................................................ 13-93 13-36 Logical Address Bus Partitioning ....................................................................................... 13-94 13-37 SDRAM Device Address Port during Address Phase ........................................................ 13-94 13-38 SDRAM Device Address Port during READ/WRITE Command...................................... 13-94 13-39 Register Settings for 128-Mbytes SDRAMs....................................................................... 13-95 13-40 Logical Address Partitioning .............................................................................................. 13-96 13-41 SDRAM Device Address Port During Address Phase........................................................ 13-96 13-42 SDRAM Device Address Port During READ/WRITE Command..................................... 13-96 13-43 Register Settings for 512-Mbyte SDRAMs ........................................................................ 13-96 13-44 SDRAM Capacitance .......................................................................................................... 13-99 |
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