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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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CP3SP33SMS/NOPB датащи(PDF) 6 Page - Texas Instruments |
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CP3SP33SMS/NOPB датащи(HTML) 6 Page - Texas Instruments |
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6 / 407 page  CPU Core AHB Bus (32-Bit) 12 MHz and 32 kHz Oscillators Dual PLL and Clock Generator Power-on-Reset Serial Debug Interface Protocol Core RF Interface Bluetooth Lower Link Controller 7K Bytes Data RAM 1K Bytes Seq. RAM CR16CPlus CPU Core with 4K Bytes Instr. Cache 32K Bytes Static RAM USB 2.0 On-The-Go Nexus Trace Module Teak DSP AHB Bus (32-Bit) Memory Interface Unit Teak 16-Bit Fixed-Point DSP 24K Bytes Data RAM DMA Controller 24K Bytes Program RAM X Y Z P External Bus Interface Unit 4K Bytes Shared RAM Peripheral Bus Controller Shared Audio Peripheral APB Bus (32-Bit) CPU Peripheral APB Bus (32-Bit) Peripheral Bus Controller Interrupt Control Unit Dual Versatile Timer Unit Dual Multi- Function Timer GPIO Multi-Input Wake-Up Microwire/ SPI 0 USART 0 UART 1/2 ACCESS .bus 0 UART 3 ACCESS .bus 1 Microwire/ SPI 1 DS325 Telematics Codec Dual CVSD/PCM Converter Advanced Audio Interface I 2 S Interface Power Management Unit Timing and Watchdog Unit 10-Channel 10-Bit A/D Converter 10 DMA Controller Dual CAN 2.0B Controller Real-Time Clock CP3SP33 SNOSCW5 – MAY 2013 www.ti.com 2 Description The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability. On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit. In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution. National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples. 2.1 Block Diagram 6 Description Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links :CP3SP33 |
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