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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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CP3SP33SMS/NOPB датащи(PDF) 2 Page - Texas Instruments |
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CP3SP33SMS/NOPB датащи(HTML) 2 Page - Texas Instruments |
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2 / 407 page  CP3SP33 SNOSCW5 – MAY 2013 www.ti.com • Flexible I/O – Multi-file C source editor, source debugger, and project manager – Up to 64 general-purpose I/O pins (shared with on-chip peripheral I/O) – Comprehensive, integrated, one-stop technical support – Programmable I/O pin characteristics: TRI- STATE output, push-pull output, weak • Bluetooth Protocol Stack pullup/pulldown input, high impedance – Applications can interface to the high-level input, high-speed drive capability protocols or directly to the low-level Host – Schmitt triggers on general-purpose inputs Controller Interface (HCI) – Multi-Input Wake-Up (MIWU) capability… – Transport layer support allows HCI command-based interface over UART port • Power Supply – Baseband (Link Controller) hardware – I/O port operation at 3.0–3.3V minimizes the bandwidth demand on the – Core logic operation at 1.8V CPU – On-chip power-on reset – Link Manager (LM) • Temperature Range – Logical Link Control and Adaptation – –40°C to +85°C (Industrial) Protocol (L2CAP) • Packages – Service Discovery Protocol (SDP) – FBGA-224, FBGA-144 – RFCOMM Serial Port Emulation Protocol • Complete Development Environment – All packet types, piconet, and scatternet – Pre-integrated hardware and software functionality support for rapid prototyping and production 1.2 CP3SP33 Connectivity Processor Selection Guide Speed On-Chip Maximum External Data General Package NSID Temp. Range (MHz) RAM External Memory Bus Width Purpose I/O Type CP3SP33SMS 96 –40°C to +85°C 32K 96M 32 64 FBGA-224 CP3SP33SMR 96 –40°C to +85°C 32K 8M 16 36 FBGA-144 2 Introduction Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links :CP3SP33 |
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