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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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VSC8504-02 датащи(PDF) 124 Page - Microsemi Corporation |
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VSC8504-02 датащи(HTML) 124 Page - Microsemi Corporation |
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124 / 131 page  Package Information VMDS-10507 VSC8504-02 Datasheet Revision 4.2 113 7 Package Information VSC8504XKS-02 and VSC8504XKS-05 are packaged in a lead(Pb)-free, 256-pin, plastic ball grid array (BGA) with a 17 mm × 17 mm body size, 1 mm pin pitch, and 1.8 mm maximum height. Lead(Pb)-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. This section provides the package drawing, thermal specifications, and moisture sensitivity rating for the VSC8504-02 device. 7.1 Package Drawing The following illustration shows the package drawing for the VSC8504-02 device. The drawing contains the top view, bottom view, side view, dimensions, tolerances, and notes. |
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