ADP1053ACPZ-R7 datasheet(33/84 Pages) AD

33 / 84 page

Data Sheet

ADP1053

Rev. A | Page 33 of 84

RTD1, RTD2, OTP1, AND OTP2 TRIM

The following procedure should be used:

Heat the thermistor or power supply to a known tempera-

ture that is equal to the OTP threshold.

Adjust the RTD1 or RTD2 gain trim register (Register 0xFE73

or Register 0xFE74) until the RTD1 or RTD2 value register

(Register 0xFED7 or Register 0xFED8) gives the correct

temperature reading at this temperature.

Adjust the OTP1 or OTP2 threshold register (Register 0xFE75

or Register 0xFE76) until the OTP1 or OTP2 flag is set.

This procedure achieves the most accurate OTP, because it takes

into account the part-to-part variations of the ADP1053 and the

thermistor used.

LAYOUT GUIDELINES

This section explains best practices that should be followed to

ensure optimal performance of the ADP1053. In general, all

related control components should be placed as close to the

ADP1053 as possible.

CS2+_A, CS2+_B, CS2−_A, and CS2−_B

The routing of the tracks from the sense resistor to the ADP1053

should be laid out in parallel to each other. The tracks should be

kept close together and as far from switch nodes as possible.

VS+_A, VS+_B, VS−_A, and VS−_B

The routing of the tracks from the remote voltage sense point

to the ADP1053 should be laid out in parallel to each other. The

tracks should be kept close together and as far from switch

nodes as possible.

VDD

Place decoupling capacitors as close to the part as possible. A

330 nF capacitor from VDD to AGND is recommended.

SDA and SCL

The routing of the tracks should be laid out in parallel to each

other. The tracks should be kept close together and as far from

switch nodes as possible.

CS, CS1_A, and CS1_B

Run the tracks from the current sense transformer to the

ADP1053 in parallel to each other. The tracks should be kept

close together and as far from switch nodes as possible.

Exposed Pad

The exposed pad underneath the ADP1053 should be soldered

to AGND.

VCORE

Place the 330 nF capacitor to DGND as close to the part as

possible.

RES

Place the 10 kΩ resistor to AGND as close to the part as

possible.

RTD1 and RTD2

Route a single trace to the ADP1053 from the thermistors. Place

the thermistors close to the hottest part of the power supply.

AGND

Create an AGND ground plane and make a single-point (star)

connection to the power supply system ground.

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