LPC55S6X datasheet(101/128 Pages) NXP

номер детали	LPC55S6X

подробное описание детали	32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS,Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG

PDF	128 Pages

Scroll/Zoom	100%

производитель	NXP [NXP Semiconductors]

домашняя страница	http://www.nxp.com

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101 / 128 page

LPC55S6x

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1.9 — 10 February 2020

101 of 128

NXP Semiconductors

LPC55S6x

32-bit ARM Cortex-M33 microcontroller

13. Application information

13.1 I/O power consumption

I/O pins are contributing to the overall dynamic and static power consumption of the part.

If pins are configured as digital inputs, a static current can flow depending on the voltage

level at the pin and the setting of the internal pull-up and pull-down resistors. This current

can be calculated using the parameters Rpu and Rpd given in Table 22 for a given input

voltage VI. For pins set to output, the current drive strength is given by parameters IOH and

IOL in Table 22, but for calculating the total static current, you also need to consider any

external loads connected to the pin.

I/O pins also contribute to the dynamic power consumption when the pins are switching

because the VDD supply provides the current to charge and discharge all internal and

external capacitive loads connected to the pin in addition to powering the I/O circuitry.

The contribution from the I/O switching current Isw can be calculated as follows for any

given switching frequency fsw if the external capacitive load (Cext) is known (see Table 22

for the internal I/O capacitance):

Isw = VDD x fsw x (Cio + Cext)

13.2 Crystal oscillator

In the crystal oscillator circuit, only the crystal (XTAL) and the capacitances CX1 and CX2

need to be connected externally on XTAL32M_P and XTAL32M_N pins. See Figure 23.

In bypass mode, an external clock (maximum frequency of up to 24 MHz) can also be

connected to XTAL32M_P if XTAL32M_N is left open. External [0 – VH] square signal can

be applied on the XTAL32M_P pin from 0 V to 850 mV.

For best results, it is very critical to select a matching crystal for the on-chip oscillator.

Load capacitance (CL), series resistance (RS), and drive level (DL) are important

parameters to consider while choosing the crystal. After selecting the proper crystal, the

external load capacitor CX1 and CX2 values can also be generally determined by the

following expression:

Fig 23. Crystal oscillator components

aaa-018147-x

LPC

XTAL32M_P

XTAL32M_N

CX2

CX1

XTAL

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