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LPC55S6X датащи(PDF) 74 Page - NXP Semiconductors

номер детали LPC55S6X
подробное описание детали  32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS,Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
PDF  128 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

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LPC55S6x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheet
Rev. 1.9 — 10 February 2020
74 of 128
NXP Semiconductors
LPC55S6x
32-bit ARM Cortex-M33 microcontroller
10.3 Power consumption
[1]
Typical ratings are not guaranteed. Typical values listed are at room temperature (25
C). Characterized through bench measurements
using typical samples.
[2]
Clock source FRO. PLL disabled
[3]
Compiler settings: IAR v.8.20.2., optimization level 0, optimized for time off.
[4]
Flash is powered down
[5]
PLL enabled
[6]
For device revision 1B, power library in SDK sets the DCDC output based on the frequency selected. For frequencies 100 MHz or
below, DCDC output is set between 1.0 V to 1.075 V, for frequencies between 101 MHz to 130 MHz, DCDC output is set between 1.025
V to 1.150 V and for frequencies above 130 MHz, DCDC output is set between 1.050 V to 1.2 V. For device revision 0A, the default
typical DCDC output is 1.1 V and for device revision 1B, the typical default DCDC output is 1.0 V.
[7]
See the FLASHCFG register in the LPC55S6x User Manual for system clock flash access time settings. Power Library in SDK sets the
flash wait states based on the frequency selected.
[1]
Typical ratings are not guaranteed. Typical values listed are at room temperature (25
C)
Table 16.
Static characteristics: Power consumption in active mode [6]
Tamb = 40 C to +105 C, unless otherwise specified. VBAT_PMU = VBAT_DCDC = VDD = 3.0 V
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
ARM Cortex-M33 (CPU0) in active mode; ARM Cortex-M33 (CPU1) in sleep mode
IDD
supply current
CoreMark code executed from
SRAMX; flash powered down
CCLK = 12 MHz
[2][3]
-0.9
-mA
CCLK = 48 MHz
[2][3]
-2.1
-mA
CCLK = 60 MHz
[2][3]
-2.3
-mA
CCLK = 96 MHz
[2][3]
-3.4
-mA
CCLK = 100 MHz
[3][4]
-3.5
-mA
CCLK = 150 MHz
[3][4]
-6.2
-mA
IDD
supply current
CoreMark code executed from flash;
CCLK = 12 MHz; 2 system clock
flash access time.
[2][3][7]
-0.95
-
mA
CCLK = 48 MHz, 5 system clock
flash access time.
[2][3][7]
-2.4
-mA
CCLK = 60 MHz, 6 system clock
flash access time.
[2][3][7]
-2.6
-mA
CCLK = 96 MHz, 8 system clock
flash access time.
[2][3][7]
-3.4
-mA
CCLK = 100 MHz, 8 system clock
flash access time.
[3][4][7]
-3.5
-mA
CCLK = 150 MHz, 12 system
clock flash access time.
[3][4][7]
-5.9
-mA
Table 17.
Static characteristics: Power consumption in sleep mode
Tamb = 40 C to +105 C, unless otherwise specified. VBAT_PMU = VBAT_DCDC = VDD = 3.0 V
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
ARM Cortex-M33 (CPU0) in sleep mode; ARM Cortex-M33 (CPU1) OFF (in reset, clock disabled)
IDD
supply current
CCLK = 12 MHz, PLL disabled
[1][2]
-0.7
-mA
CCLK = 96 MHz, PLL disabled
[2]
-2.7
-mA



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