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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LPC55S6X датащи(PDF) 71 Page - NXP Semiconductors |
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LPC55S6X датащи(HTML) 71 Page - NXP Semiconductors |
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71 / 128 page  LPC55S6x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2020. All rights reserved. Product data sheet Rev. 1.9 — 10 February 2020 71 of 128 NXP Semiconductors LPC55S6x 32-bit ARM Cortex-M33 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. [1] Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment [2] Thermal test board meets JEDEC specification for this package (JESD51-9). [3] Junction-to-Case thermal resistance determined using an isothermal cold plate. Case is defined as the bottom of the packages (exposed pad) Tj Tamb PD Rth j a – + = Table 12. Thermal resistance Symbol Parameter Conditions Max/Min Unit HLQFP100 Package Rth(j-a) thermal resistance from junction to ambient [1] JESD51-9, 2s2p[2] 27 C/W Rth(j-c) thermal resistance from junction to case [3] JESD51-9[2] 2.0 C/W VFBGA98 Package Rth(j-a) thermal resistance from junction to ambient [1] JESD51-9, 2s2p[2] 56 C/W Rth(j-c) Junction-to-Top of Package Thermal Characterization Parameter [3] JESD51-9[2] 0.7 C/W HTQFP 64 Package Rth(j-a) thermal resistance from junction to ambient [1] JESD51-9, 2s2p[2] 28 C/W Rth(j-c) thermal resistance from junction to case [3] JESD51-9[2] 0.3 C/W Table 13. Maximum Junction Temperature Symbol Parameter Conditions Max Unit Tjmax maximum junction temperature + 107 C |
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