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LPC55S6X датащи(PDF) 37 Page - NXP Semiconductors |
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LPC55S6X датащи(HTML) 37 Page - NXP Semiconductors |
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37 / 128 page ![]() LPC55S6x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2020. All rights reserved. Product data sheet Rev. 1.9 — 10 February 2020 37 of 128 NXP Semiconductors LPC55S6x 32-bit ARM Cortex-M33 microcontroller [1] PU = input mode, pull-up enabled (pull-up resistor pulls pin up towards VDD). PD = input mode, pull-down enabled (pull-down resistor pulls pin down towards VSS). Z = high impedance; pull-up, pull-down, and input disabled. AI = analog input. I = input. O = output. I/O = input/output. Reset state reflects the pin state at reset without boot code operation. For termination on unused pins, see Section 6.1.1 “Termination of unused pins”. [2] Pad with programmable glitch filter; provides digital I/O functions with TTL levels and hysteresis; normal drive strength. Pulse width of spikes or glitches suppressed by input filter is from 3 ns to 16 ns (simulated value). [3] True open-drain pin. I2C-bus pins compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus. The pin requires an external pull-up to provide output functionality. When power is switched off, this pin is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [4] Pin providing standard digital I/O functions with configurable modes, configurable hysteresis, and analog input. When configured as an analog input, the digital section of the pin is disabled. [5] Reset pad with glitch filter and hysteresis. Pulse width of spikes or glitches suppressed by input filter is from 3 ns to 20 ns (simulated value) [6] Transparent analog pad. [7] Optional bypass mode is supported, xtal32M_P can be driven by an external clock with restrictions in terms of drive level. [8] The corresponding VBUS must be connected to supply voltage when using the USB peripheral. VBUS is 5V tolerant. [9] Main battery supply: Star connection at application level (PCB). [10] If the USB1_3V3 pin is not using the same supply as the VBAT_PMU pin, the application should ensure the supply on USB1_3V3 does not drop below 2.8 V. If the USB1_3V3 pin is using separate supply and this voltage unexpectedly drops below 2.8 V, the USB PHY can go into unknown state causing USB transactions (R/W) to hang. In this case, the application can detect this event with a time-out and would have to recover by performing a USB reset. VBAT_ PMU 33 M13 51 [9] - - Analog supply. VDD 8; 16; 43; 54 M1; A5; A9; A13 15; 25; 44; 63; 69;75; 84; 95; 100 - - Single 1.8 V to 3.6 V power supply powers I/Os. VDD_PMU 28 M9 39 - - Core supply. For applications with DCDC converter, VDD_PMU and FB are tied at PCB level. VDDA 9 G2 16 - - Analog supply voltage. At PCB level, has to be tied to main supply (VBAT_PMU, VBAT_DCDC) VREFN - H1 18 - - ADC negative reference voltage. VREFP 10 G1 17 - - ADC positive reference voltage. VSS exposed pad N1; B5; B9; B13 exposed pad - - Ground. VSS_DCDC 30 N12, M12 46, 47 - - Star ground connection is managed to PCB ground plane. VSS_PMU - M11 - - - Star ground connection is managed to PCB ground plane. VSSA 11 H2 19 - - Analog ground. XTAL32K_N 35 J12 53 - - RTC oscillator output. XTAL32K_P 34 J13 52 - - RTC oscillator input. XTAL32M_N 19 M3 28 [7] - - Main oscillator output. XTAL32M_P 20 N3 29 [7] - - Main oscillator input. Table 3. Pin description …continued Symbol Description |
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