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LFSC датащи(PDF) 33 Page - Lattice Semiconductor

номер детали LFSC
подробное описание детали  LatticeSC/M Family Data Sheet
PDF  237 Pages
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производитель  LATTICE [Lattice Semiconductor]
домашняя страница  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

LFSC датащи(HTML) 33 Page - Lattice Semiconductor

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2-29
Architecture
Lattice Semiconductor
LatticeSC/M Family Data Sheet
PCI Clamp
A programmable PCI clamp is available on the top and bottom banks of the device. The PCI clamp can be turned
“ON” or “OFF” on each pin independently. The PCI clamp is used when implementing a 3.3V PCI interface. The PCI
Specification, Revision 2.2 requires the use of clamping diodes for 3.3V operation. For more information on the PCI
interface, please refer to the PCI Specification, Revision 2.2.
Programmable Slew Rate Control
All output and bidirectional buffers have an optional programmable output slew rate control that can be configured
for either low noise or high-speed performance. Each I/O pin has an individual slew rate control. This allows
designers to specify slew rate control on a pin-by-pin basis. This slew rate control affects both the rising and falling
edges.
Programmable Termination
Many of the I/O standards supported by the LatticeSC devices require termination at the transmitter, receiver or both.
The SC devices provide the capability to implement many kinds of termination on-chip, minimizing stub lengths and
hence improving performance. Utilizing this feature also has the benefit of reducing the number of discrete compo-
nents required on the circuit board. The termination schemes can be split into two categories single-ended and differ-
ential.
Single Ended Termination
Single Ended Outputs: The SC devices support a number of different terminations for single ended outputs:
• Series
• Parallel to VCCIO or GND
• Parallel to VCCIO/2
• Parallel to VCCIO/2 combined with series
Figure 2-27 shows the single ended output schemes that are supported. The nominal values of the termination resis-
tors are shown in Table 2-10.



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