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MSP430 датащи(PDF) 85 Page - Texas Instruments |
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MSP430 датащи(HTML) 85 Page - Texas Instruments |
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85 / 88 page ![]() www.ti.com PACKAGE OUTLINE 4.1 3.9 4.1 3.9 0.7 0.6 0.01 0.00 2X 2.5 20X 0.5 2X 2.5 24X 0.6 0.4 24X 0.3 0.2 (0.2) TYP 24X (0.18) (0.1) TYP (0.663) (0.25) UQFN - 0.7 mm max height RRU0024A PLASTIC QUAD FLATPACK - NO LEAD 4225850/A 04/2020 0.08 C 0.1 C A B 0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA 0.05 C SEATING PLANE 0.01 C PIN 1 ID SYMM SYMM 1 6 7 12 13 18 19 24 7X (45 X 0.087) SCALE 3.000 A B C |
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