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MSP430 датащи(PDF) 38 Page - Texas Instruments

номер детали MSP430
подробное описание детали  AFEx8101 16-Bit and 14-Bit, Low-Power DACs With Voltage Reference and Diagnostic ADC for 4-mA to 20-mA Loop-Powered Applications
PDF  88 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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MSP430 датащи(HTML) 38 Page - Texas Instruments

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7.3.3.2 Alarm Voltage Generator
Figure 7-12 shows that the alarm voltage is generated independently from the DAC output voltage. The alarm
polarity control logic selects the output level of the alarm voltage generator. The alarm action control logic
selects between the DAC output and alarm voltage generator output voltages. The alarm action control logic also
controls the output buffer Hi-Z switch.
POL_SEL/
AIN1
VDD
GND
Alarm
Voltage
Generator
0
1
OUT = 0.15 V
OUT = 1.25 V
DAC_DATA
DAC
0
1
+
–
ALARM_ACT
Register 10h
VOUT
G
PVDD =1.8 V: G = 1
PVDD > 2.7 V: G = 2
Hi-Z
ALMV_POL
0
1
DAC_CLR_CODE
DAC_CODE
Figure 7-12. Alarm Voltage Generator Architecture
During normal operation, the expected VOUT voltage depends on the DAC_CODE. The ADC thresholds for the
SD4 (VOUT) diagnostic channel are set around the programmed DAC_CODE. During the alarm condition, if the
alarm action changes the VOUT voltage to the alarm voltage, or switches the VOUT buffer into Hi-Z mode, the
VOUT voltage no longer depends on the DAC_CODE. In this case, the SD4 (VOUT) diagnostic channel also
reports the alarm. To clear this alarm, as long as all other alarm conditions are cleared, set the alarm action
to either no action or to the DAC clear code. Applying either alarm action sets the VOUT voltage within the
expected ADC thresholds and clears the alarm after the next ADC measurement of the SD4 (VOUT) channel.
Give special consideration to the alarm logic during the transient events. When the new DAC_CODE goes
beyond the SD4 (VOUT) alarm thresholds with the ADC monitoring the SD4 (VOUT) input in auto mode, the
ADC conversion can occur while VOUT settles to a new value. This conversion can trigger a false alarm. There
are two ways to prevent this false alarm:
1. Use direct mode and allow VOUT to settle before triggering the next ADC conversion.
2. Set ADC_CFG.FLT_CNT > 0. With this configuration, a single error in SD4 or any other measurement does
not cause an alarm condition to be asserted.
7.3.3.3 Temperature Sensor Alarm Function
The AFEx8101 continuously monitor the internal die temperature. In addition to the ADC measurement, the
temperature sensor triggers a comparator to show a thermal warning and a thermal error. A thermal warning
alarm is set when the temperature exceeds 85°C. Additionally, a thermal error alarm is set when the die
temperature exceeds 130°C.
The thermal warning and thermal error alarms can be configured to set the ALARM pin and are indicated
in the ALARM_STATUS register. These alarms can be masked with the ALARM_MASK register and also be
configured to control the DAC output with the ALARM_ACT register.
7.3.3.4 Internal Reference Alarm Function
The devices provide out-of-range detection for the reference voltage. When the reference voltage exceeds ±5%
of the nominal value, the reference alarm flag (VREF_FLT bit) is set. Make sure that a reference alarm condition
has not been issued by the device before powering up the DAC output.
AFE78101, AFE88101
SLASF21 – DECEMBER 2022
www.ti.com
38
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: AFE78101 AFE88101



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