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VSC8221 датащи(PDF) 116 Page - Microsemi Corporation |
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VSC8221 датащи(HTML) 116 Page - Microsemi Corporation |
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116 / 138 page ![]() VSC8221 Data Sheet VMDS-10106 Revision 4.1 December 2006 116 of 123 123 26 CLOCKING SPECIFICATIONS 26.1 Reference Clock Option The following component specifications should be used to select a clock reference for use with the VSC8221. For more information about clocking and frequency offset tolerance specifications when jumbo packet support is required, see the application note Using Jumbo Packets with SimpliPHYs, available from the Microsemi Web site. 26.2 Crystal Option The following component specifications should be used to select a crystal for use with the VSC8221. For more information about clocking and frequency offset tolerance specifications when jumbo packet support is required, see the application note Using Jumbo Packets with SimpliPHYs , available from the Microsemi Web site. Table 50. Reference Clock Option Specifications Symbol Min Typ Max Unit Parameter Description & Conditions FTOL-25MHZ -100 ppm 25 +100 ppm MHz Total frequency offset tolerance (25 MHz clock option), including, initial offset, stability over temperature. TR1, TF1 4ns Rise and fall time (20% to 80%), 25 MHz clock option. TR2, TF2 0.8 ns Rise and fall time (20% to 80%), 125 MHz clock option. DUTY 45 55 % Duty cycle (25 MHz and 125 MHz clock options). Table 51. Crystal Option Specifications Symbol Min Typ Max Unit Parameter Description & Conditions FREF 25 MHz Fundamental mode, AT-cut type, parallel resonant crystal reference frequency. FTOL(TOTAL) -50 +50 ppm Fundamental mode, AT-cut type, parallel resonant crystal total frequency offset, including, initial offset, stability over temperature, aging and capacitive loading. CL 18 20 pF Crystal parallel load capacitance. CL-EXT 30 pF Crystal external load capacitors to GND.1 1 These values can depend on board parasitics. ESR 10 30 Ω Equivalent series resistance of crystal. PD 0.5 mW Crystal oscillator drive level. |
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