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VSC8221 датащи(PDF) 108 Page - Microsemi Corporation |
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VSC8221 датащи(HTML) 108 Page - Microsemi Corporation |
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108 / 138 page ![]() VSC8221 Data Sheet VMDS-10106 Revision 4.1 December 2006 108 of 123 123 24.3 Thermal Application Data VDD12 1.14 1.2 1.26 V DC voltage on VDD12 pins FREFCLK 25 125 MHz Local reference clock (REFCLK) nominal frequency. Refer to FTOL for minimum and maximum values. FTOL (REFCLK) -100 +100 ppm Reference clock frequency offset tolerance over specified temperature range (25 MHz or 125 MHz) FTOL (LiNK) -1500 +1500 ppm CAT5 link partner frequency offset tolerance (for any link speed) REXT 2.00 k Ω External reference circuit bias resistor (1% tolerance). CREF_FiLT 0.1 µF External reference generator filter capacitor (10% tolerance). TOPER 0100 °C Operating temperature. Lower limit of specification is ambient temperature, and upper limit is case temperature. Table 36. Thermal Application Data Printed Circuit Board Conditions (JEDEC JESD51-9) PCB Layers 4 PCB Dimensions (mm x mm) 101.6 × 114.3 PCB Thickness (mm) 1.6 Environment Conditions Maximum operating junction temperature (ºC) 125 Ambient free-air operating temperature (ºC) 70 Worst Case Power Dissipation (W) 1 Table 37. Thermal Resistances Symbol Typ Unit Parameter Description & Conditions θ JA (0 m/s airflow) 40.8 °C/W Junction-to-ambient thermal resistance θ JA (1 m/s airflow) 35.5 °C/W Junction-to-ambient thermal resistance θ JA (2 m/s airflow) 34.1 °C/W Junction-to-ambient thermal resistance ψ JT (0 m/s airflow) 0.17 °C/W Junction-to-top center of case thermal resistance ψ JT (1 m/s airflow) 0.19 °C/W Junction-to-top center of case thermal resistance Table 35. Recommended Operating Conditions (continued) Symbol Min Typ Max Unit Parameter Description & Conditions |
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