ADP1055ACPZ-R7 datasheet(12/140 Pages) AD

12 / 140 page

ADP1055

Data Sheet

Rev. A | Page 12 of 140

Pin No.

Mnemonic

Description

GPIO2

Programmable General-Purpose Input/Output. If this pin is not used, connect it to AGND.

GPIO1

Programmable General-Purpose Input/Output. If this pin is not used, connect it to AGND.

CTRL

Power Supply On Input. This signal is referenced to AGND. This pin is the hardware PSON control signal. It is

recommended that a 1 nF capacitor be connected from the CTRL pin to AGND for decoupling. If this pin is not

used, connect it to AGND.

SCL

I2C/PMBus Serial Clock Input and Output (Open Drain). This signal is referenced to AGND.

SDA

I2C/PMBus Serial Data Input and Output (Open Drain). This signal is referenced to AGND.

SMBALRT

Power-Good Output (Open Drain). This signal is referenced to AGND. This pin is also used as the PMBus ALERT

signal.

ISHARE

Digital Current Sharing Input and Output (Open Drain). This signal is referenced to AGND.

VCORE

VDD for the Digital Core. Connect a decoupling capacitor of at least 330 nF (1 μF maximum) from this pin to DGND

as close to the IC as possible to minimize the PCB trace length. Do not use the VCORE pin as a reference or load it

in any way.

VDD

Positive Supply Input. This signal is referenced to AGND. Connect a 4.7 μF decoupling capacitor from this pin to

AGND as close to the IC as possible to minimize the PCB trace length.

DGND

Digital Ground. This pin is the ground reference for the digital circuitry. Star connect to AGND.

AGND

IC Analog Ground.

JRTN

Temperature Sensor Return. If this pin is not used, connect it to AGND.

RES

Resistor Input. This pin sets the internal reference for the internal PLL frequency. Connect a 10 kΩ resistor (±0.1%)

from RES to AGND. Do not load this pin with any capacitance. This signal is referenced to AGND.

ADD

I2C/PMBus Address Select Input. Connect a resistor from ADD to AGND. This signal is referenced to AGND.

JTD

Thermal Sensor Input. A PN junction sensor is connected from this pin to the JRTN pin. If this pin is not used,

connect it to JRTN.

Exposed Pad. For increased reliability of the solder joints and maximum thermal capability, it is recommended

that the exposed pad on the underside of the package be soldered to the PCB AGND plane.

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