MNSC140CORE datasheet(33/80 Pages) FREESCALE

33 / 80 page

DC Electrical Characteristics

MSC8102 Quad Core Digital Signal Processor, Rev. 12

Freescale Semiconductor

2-3

2.4 DC Electrical Characteristics

This section describes the DC electrical characteristics for the MSC8102. The measurements in Table 2-4 assume

the following system conditions:

•TA = 25 °C

•VDD = 1.55–1.7 VDC

•VDDH = 3.3 V ± 5% VDC

• GND = 0 VDC

Note:

The leakage current is measured for nominal VDDH and VDD or both VDDH and VDD must vary in the same

direction (for example, both VDDH and VDD vary by +2 percent or both vary by –2 percent).

Table 2-4.

DC Electrical Characteristics

Characteristic

Symbol

Min

Typical

Max

Unit

Input high voltage

1, all inputs except CLKIN

VIH

2.0

3.0

3.465

Input low voltage1

VIL

GND

0.4

CLKIN input high voltage

VIHC

2.4

3.0

3.465

CLKIN input low voltage

VILC

GND

0.4

Input leakage current, VIN = VDDH

IIN

–1.0

0.09

µA

Tri-state (high impedance off state) leakage current, VIN = VDDH

IOZ

–1.0

0.09

µA

Signal low input current, VIL = 0.4 V

–1.0

0.09

µA

Signal high input current, VIH = 2.0 V

–1.0

0.09

µA

Output high voltage, IOH = –2 mA, except open drain pins

VOH

2.0

3.0

—

Output low voltage, IOL= 3.2 mA

VOL

—

0.4

Internal supply current:

•

In Wait mode

— 250 MHz

— 275 MHz

•

In Stop mode

— 250 MHz

— 275 MHz

IDDW

IDDS

—

203

222

—

Typical power consumption3 at:

•250 MHz

•275 MHz

—

1.35

1.47

—

Notes:

See Figure 2-1 for undershoot and overshoot voltages.

Not tested. Guaranteed by design.

The typical power was measured using an EFR code with the device running at room temperature (TA = 25°C). No

peripherals were enabled and ICache was not enabled. The source code was optimized to utilize all the ALUs and AGUs and

all four cores. It was created using CodeWarrior

® 2.5 by Metrowerks®. These values are provided as examples only. Power

consumption is application dependent and varies widely. To assure proper board design with regard to thermal dissipation

and proper operating temperatures, evaluate power consumption for your application and use the design guidelines in

Chapter 4 and in

MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601).

MNSC140CORE датащи(PDF) 33 Page - Freescale Semiconductor, Inc

MNSC140CORE датащи(HTML) 33 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80

датащи скачать

ссылки URL