MNSC140CORE datasheet(32/80 Pages) FREESCALE

32 / 80 page

MSC8102 Quad Core Digital Signal Processor, Rev. 12

2-2

Freescale Semiconductor

Specifications

2.2 Recommended Operating Conditions

Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is not

guaranteed.

2.3 Thermal Characteristics

Table 2-3 describes thermal characteristics of the MSC8102 for the FC-CBGA (HCTE) package.

Section 4.5 describes these characteristics. The application note entitled MSC8102, MSC8122, and MSC8126

Thermal Management Design Guidelines (AN2601) describes the performance of the MSC8102 devices under

standard thermal test conditions and when mounted in a component array. It also provides guidelines for evaluating

board layouts that use MSC8102 devices.

Table 2-2.

Recommended Operating Conditions

Rating

Symbol

Value

Unit

Core supply voltage

VDD

1.55 to 1.7

PLL supply voltage

VCCSYN

1.55 to 1.7

I/O supply voltage

VDDH

3.135 to 3.465

Input voltage

VIN

–0.2 to VDDH+0.2

Operating temperature range

maximum: 105

minimum: –25

°C

Table 2-3.

Thermal Characteristics for FC-CBGA (HCTE) Package

Characteristic

Symbol

FC-CBGA (HCTE) 20

× 20 mm5

Unit

Natural

Convection

100 ft/min

(0.5 m/s) airflow

200 ft/min

(1 m/s) airflow

Junction-to-ambient1, 2

RθJA or θJA

°C/W

Junction-to-ambient, four-layer board1, 3

RθJA or θJA

°C/W

Junction-to-board (bottom)

RθJB or θJB

4.4

°C/W

Junction-to-case5

RθJC or θJC

0.3

°C/W

Notes:

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and EIA/JESD51-2 with the single layer (1s) board horizontal.

Per JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on

the top surface of the board near the package.

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL

SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

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