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MPC821 датащи(PDF) 4 Page - NXP Semiconductors |
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MPC821 датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 242 page ![]() General Information MPC8XXFADS Design Specification—Rev 0.1 PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE 1•5 SPECIFICATIONS The MPC8XXFADS specifications are given in TABLE 1-1. TABLE 1-1. MPC8XXFADS Specifications CHARACTERISTICS SPECIFICATIONS Power requirements (no other boards attached) +5Vdc @ 1.7 A (typical), 3 A (maximum) +12Vdc - @1A. Microprocessor MPC8XX running upto @ 50 MHz Addressing Total address range: Flash Memory Dynamic RAM Synchronous DRAM 4 GigaBytes 2 MByte, 32 bits wide expandable to 8 MBytes 4 MByte, 32 bits wide EDO SIMM Support for up to 32 MByte, EDO or FPM SIMM 4 MBytes, organized as 1 Meg X 32 bit. Operating temperature 0OC - 30OC Storage temperature -25OC to 85OC Relative humidity 5% to 90% (non-condensing) Dimensions: Length Width Thickness 9.173" (233 mm) 6.3" (160 mm) 0.063" (1.6 mm) Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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