K32L2AX datasheet(59/96 Pages) NXP

59 / 96 page

Table 29. Oscillator frequency specifications (continued)

Symbol

Description

Min.

Typ.

Max.

Unit

Notes

fosc_hi_2

Oscillator crystal or resonator frequency — high

frequency range

(SCG_SOSCCFG[RANGE]=11)

—

MHz

fec_extal

Input clock frequency (external clock mode)

—

MHz

1, 2

tdc_extal

Input clock duty cycle (external clock mode)

tcst

Crystal startup time — 32 kHz low-frequency,

low-power mode (HGO=0)

—

750

—

3, 4, 5

Crystal startup time — 32 kHz low-frequency,

high-gain mode (HGO=1)

—

250

—

Crystal startup time — 8 MHz medium

frequency (SCG_SOSCCFG[RANGE]=11), low-

power mode (HGO=0)

—

0.6

—

Crystal startup time — 8 MHz medium

frequency (SCG_SOSCCFG[RANGE]=10),

high-gain mode (HGO=1)

—

1. Other frequency limits may apply when external clock is being used as a reference for the PLL.

2. When transitioning to system PLL mode, restrict the frequency of the input clock so that, when it is divided by

PREDIV, it remains within the limits of the PLL reference input clock frequency.

3. Proper PC board layout procedures must be followed to achieve specifications.

4. Crystal startup time is defined as the time between the oscillator being enabled and the SCG_SOSCCSR[SOSCVLD]

being set.

5. Crystal startup time is dependent on external crystal and/or resonator and loading capacitance as well as series

resistance.

8.4 Memories and memory interfaces

8.4.1 Flash electrical specifications

This section describes the electrical characteristics of the flash memory module.

8.4.1.1 Flash timing specifications — program and erase

The following specifications represent the amount of time the internal charge pumps

are active and do not include command overhead.

Table 30. Flash program/erase timing specifications

Symbol

Description

Min.

Typ.

Max.

Unit

Notes

thvpgm4

Longword Program high-voltage time

—

7.5

μs

—

thversscr

Sector Erase high-voltage time

—

113

Table continues on the next page...

Peripheral operating requirements and behaviors

K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021

NXP Semiconductors

K32L2AX датащи(PDF) 59 Page - NXP Semiconductors

K32L2AX датащи(HTML) 59 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96

датащи скачать

ссылки URL