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K32L2AX датащи(PDF) 49 Page - NXP Semiconductors |
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K32L2AX датащи(HTML) 49 Page - NXP Semiconductors |
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49 / 96 page ![]() 2. VDD = 3.3 V, VREGIN= 5V, TA = 25 °C, fOSC = 8 MHz (crystal), fSYS_CORE = 96 MHz, fBUS = 24 MHz 3. IEC/SAE level maximum: L≤24dB mV 7.2.7 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to www.nxp.com. 2. Perform a keyword search for “EMC design.” 7.2.8 Capacitance attributes Table 19. Capacitance attributes Symbol Description Min. Max. Unit CIN Input capacitance — 7 pF 7.3 Switching specifications 7.3.1 Device clock specifications Table 20. Device clock specifications Symbol Description Min. Max. Unit Run mode1 Normal run mode fSYS System and core clock (DIVCORE_CLK) — 96 MHz High speed run mode — 72 MHz Normal speed run mode — 8 MHz VLPR mode fBUS Bus clock/Slow clock (DIVSLOW_CLK) — 24 MHz High speed run mode and Normal speed run mode — 1 MHz VLPR mode fFLASH Flash clock — 24 MHz High speed run mode and Normal speed run mode — 1 MHz VLPR mode fLLWU LLWU clock — 1 KHz All modes fRCM RCM clock — 1 KHz All modes Table continues on the next page... General K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021 49 NXP Semiconductors |
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