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K32L2AX датащи(PDF) 53 Page - NXP Semiconductors

номер детали K32L2AX
подробное описание детали  K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM
PDF  96 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

K32L2AX датащи(HTML) 53 Page - NXP Semiconductors

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7.4.2 Thermal attributes
Table 23. Thermal attributes
Board type1
Symbol
Description
100 LQFP 64 LQFP
Unit
Notes
Four-layer (2s2p)
RθJA
Thermal resistance, junction to
ambient (natural convection)
51
44
°C/W
Four-layer (2s2p)
ΨJT
Thermal characterization
parameter, junction to package top
outside center (natural convection)
4
1.2
°C/W
2
1. Thermal test board meets JEDEC specification for this package (JESD51-9).
2. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
8 Peripheral operating requirements and behaviors
8.1 Core modules
8.1.1 SWD electricals
Table 24. SWD full voltage range electricals
Symbol
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
J1
SWD_CLK frequency of operation
• Serial wire debug
0
25
MHz
J2
SWD_CLK cycle period
1/J1
—
ns
J3
SWD_CLK clock pulse width
• Serial wire debug
20
—
ns
J4
SWD_CLK rise and fall times
—
3
ns
J9
SWD_DIO input data setup time to SWD_CLK rise
10
—
ns
J10
SWD_DIO input data hold time after SWD_CLK rise
0
—
ns
J11
SWD_CLK high to SWD_DIO data valid
—
32
ns
J12
SWD_CLK high to SWD_DIO high-Z
5
—
ns
Peripheral operating requirements and behaviors
K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021
53
NXP Semiconductors



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