K32L2AX datasheet(3/96 Pages) NXP

3 / 96 page

Table of Contents

1 Ordering information............................................................5

2 Overview............................................................................. 5

2.1

System features.........................................................6

2.1.1

Arm Cortex-M0+ core.................................. 6

2.1.2

NVIC............................................................ 7

2.1.3

AWIC........................................................... 7

2.1.4

Memory........................................................8

2.1.5

Reset and boot............................................ 8

2.1.6

Clock options............................................... 11

2.1.7

Security........................................................13

2.1.8

Power management.....................................14

2.1.9

LLWU...........................................................16

2.1.10

Debug controller.......................................... 18

2.2

Peripheral features.....................................................18

2.2.1

16-bit SAR ADC...........................................18

2.2.2

Crossbar Switch Lite (AXBS-Lite)................18

2.2.3

Bit Manipulation Engine2 (BME2)................19

2.2.4

Cryptographic Acceleration Unit (CAU)....... 19

2.2.5

Comparator (CMP)...................................... 19

2.2.6

12-bit DAC................................................... 20

2.2.7

Direct Memory Access Multiplexer

(DMAMUX).................................................. 20

2.2.8

EMVSIM.......................................................20

2.2.9

Flexible I/O (FlexIO).....................................20

2.2.10

General-Purpose Input/Output (GPIO)........ 21

2.2.11

Low Power Inter-Integrated Circuit (LPI2C).21

2.2.12

The Low Power Periodic Interrupt Timer

(LPIT)...........................................................21

2.2.13

Low Power Serial Peripheral Interface

(LPSPI)........................................................ 22

2.2.14

Low-Power Timer (LPTMR)......................... 22

2.2.15

Low Power Universal Asynchronous

Receiver/Transmitter (LPUART)..................22

2.2.16

Peripheral Clock Control (PCC)...................23

2.2.17

Real Time Clock (RTC)................................23

2.2.18

Timer/PWM Module (TPM).......................... 23

2.2.19

Touch Sensing Input (TSI)...........................23

2.2.20

Universal Serial Bus (USB) FS.................... 24

2.2.21

Voltage Reference (VREF).......................... 24

2.2.22

Watchdog (WDOG)......................................25

3 Memory Map....................................................................... 25

4 Pinouts and Packaging....................................................... 27

4.1

Signal Multiplexing and Pin Assignments.................. 27

4.2

K32 L2A Pinouts........................................................ 31

5 Dimensions..........................................................................33

5.1

Obtaining package dimensions..................................33

6 Ratings................................................................................ 34

6.1

Thermal handling ratings........................................... 34

6.2

Moisture handling ratings...........................................34

6.3

ESD handling ratings................................................. 34

6.4

Voltage and current operating ratings........................35

7 General............................................................................... 35

7.1

AC electrical characteristics.......................................35

7.2

Nonswitching electrical specifications........................36

7.2.1

Voltage and current operating

requirements................................................36

7.2.2

LVD, HVD, and POR operating

requirements................................................37

7.2.3

Voltage and current operating behaviors.....38

7.2.4

Power mode transition operating behaviors 39

7.2.5

Power consumption operating behaviors.....40

7.2.6

EMC radiated emissions operating

behaviors..................................................... 48

7.2.7

Designing with radiated emissions in mind..49

7.2.8

Capacitance attributes.................................49

7.3

Switching specifications.............................................49

7.3.1

Device clock specifications.......................... 49

7.3.2

General switching specifications..................50

7.4

Thermal specifications............................................... 52

7.4.1

Thermal operating requirements..................52

7.4.2

Thermal attributes........................................52

8 Peripheral operating requirements and behaviors.............. 53

8.1

Core modules.............................................................53

8.1.1

SWD electricals .......................................... 53

8.2

System modules........................................................ 54

8.3

Clock modules........................................................... 54

8.3.1

System Clock Generation (SCG)

specifications............................................... 54

8.3.2

Oscillator electrical specifications................ 57

8.4

Memories and memory interfaces..............................59

8.4.1

Flash electrical specifications...................... 59

8.5

Security and integrity modules...................................61

8.6

Analog........................................................................61

8.6.1

ADC electrical specifications....................... 61

8.6.2

Voltage reference electrical specifications...66

8.6.3

CMP and 6-bit DAC electrical

specifications............................................... 67

8.6.4

12-bit DAC electrical characteristics............ 69

8.7

Timers........................................................................72

8.8

Communication interfaces......................................... 72

8.8.1

EMV SIM specifications............................... 72

8.8.2

USB electrical specifications........................77

8.8.3

USB VREG electrical specifications............ 78

8.8.4

LPSPI switching specifications.................... 78

8.8.5

LPI2C...........................................................83

8.8.6

LPUART.......................................................83

8.9

Human-machine interfaces (HMI).............................. 84

8.9.1

TSI electrical specifications......................... 84

9 Design considerations.........................................................84

9.1

Hardware design considerations................................84

K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021

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