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TMS320LC2401AVFS датащи(PDF) 128 Page - Texas Instruments

номер детали TMS320LC2401AVFS
подробное описание детали  DSP CONTROLLERS
PDF  134 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

TMS320LC2401AVFS датащи(HTML) 128 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TMS320LC2402APAGA
ACTIVE
TQFP
PAG
64
TBD
Call TI
Call TI
TMS320LC2402APAGS
ACTIVE
TQFP
PAG
64
TBD
Call TI
Call TI
TMS320LC2402APGA
ACTIVE
QFP
PG
64
TBD
Call TI
Call TI
TMS320LC2402APGS
ACTIVE
QFP
PG
64
TBD
Call TI
Call TI
TMS320LC2403APAGA
ACTIVE
TQFP
PAG
64
TBD
Call TI
Call TI
TMS320LC2403APAGS
ACTIVE
TQFP
PAG
64
TBD
Call TI
Call TI
TMS320LC2406APZA
ACTIVE
LQFP
PZ
100
TBD
Call TI
Call TI
TMS320LC2406APZS
ACTIVE
LQFP
PZ
100
TBD
Call TI
Call TI
TMS320LF2402APGA
ACTIVE
QFP
PG
64
66
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72HR
TMS320LF2402APGAR
ACTIVE
QFP
PG
64
400
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72HR
TMS320LF2402APGS
ACTIVE
QFP
PG
64
66
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72HR
TMS320LF2403APAGA
ACTIVE
TQFP
PAG
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168HR
TMS320LF2403APAGS
ACTIVE
TQFP
PAG
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168HR
TMS320LF2406APZA
ACTIVE
LQFP
PZ
100
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YR
TMS320LF2406APZAR
ACTIVE
LQFP
PZ
100
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YR
TMS320LF2406APZS
ACTIVE
LQFP
PZ
100
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YR
TMS320LF2407APGEA
ACTIVE
LQFP
PGE
144
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMS320LF2407APGES
ACTIVE
LQFP
PGE
144
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1



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