PIC16C71 datasheet(200/337 Pages) MICROCHIP

200 / 337 page

PIC16C6X

DS30234D-page 200

Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67

19.1

DC Characteristics:

PIC16C62A/R62/64A/R64-04 (Commercial, Industrial, Extended)

PIC16C62A/R62/64A/R64-10 (Commercial, Industrial, Extended)

PIC16C62A/R62/64A/R64-20 (Commercial, Industrial, Extended)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40˚C

≤ TA ≤ +125˚C for extended,

-40˚C

≤ TA ≤ +85˚C for industrial and

0˚C

≤ TA ≤ +70˚C for commercial

Param

No.

Characteristic

Sym

Min

Typ† Max Units

Conditions

D001

D001A

Supply Voltage

VDD

4.0

4.5

6.0

5.5

XT, RC and LP osc conﬁguration

HS osc conﬁguration

D002*

RAM Data Retention

Voltage (Note 1)

VDR

1.5

D003

VDD start voltage to

ensure internal Power-on

Reset signal

VPOR

-VSS

See section on Power-on Reset for details

D004*

VDD rise rate to ensure

internal Power-on Reset

signal

SVDD

0.05

V/ms See section on Power-on Reset for details

D005

Brown-out Reset Voltage

BVDD

3.7

4.0

4.3

BODEN bit in conﬁguration word enabled

3.7

4.0

4.4

Extended Range Only

D010

D013

D015*

Supply Current (Note 2, 5)

Brown-out Reset Current

(Note 6)

IDD

∆ IBOR

2.7

350

425

µA

XT, RC, osc conﬁguration FOSC = 4 MHz,

VDD = 5.5V (Note 4)

HS osc configuration FOSC = 20 MHz,

VDD = 5.5V

BOR enabled, VDD = 5.0V

D020

D021

D021A

D021B

D023*

Power-down Current

(Note 3, 5)

Brown-out Reset Current

(Note 6)

IPD

∆ IBOR

10.5

1.5

2.5

350

425

µA

VDD = 4.0V, WDT enabled, -40

°C to +85°C

VDD = 4.0V, WDT disabled, -0

°C to +70°C

VDD = 4.0V, WDT disabled, -40

°C to +85°C

VDD = 4.0V, WDT disabled, -40

°C to +125°C

BOR enabled, VDD = 5.0V

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and

are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as speciﬁed.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-

sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20

µA to the speciﬁcation. This value is from character-

ization and is for design guidance only. This is not tested.

6: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

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