MPC8610EC datasheet(92/96 Pages) FREESCALE

92 / 96 page

MPC8610 Integrated Host Processor Hardware Specifications, Rev. 0

Package Information

Freescale Semiconductor

Notes for Figure 58:

1 All dimensions are in millimeters.

2 Dimensions and tolerances per ASME Y14.5M-1994.

3 Maximum solder ball diameter measured parallel to datum A.

4 Datum A, the seating plane, is defined by the spherical crowns of the solder balls.

5 Capacitors may not be present on all devices.

6 Caution must be taken not to short capacitors or expose metal capacitor pads on package top.

7 All dimensions symmetrical about centerlines unless otherwise specified.

4.3

Ordering Information

Ordering information for the parts fully covered by this specification document is provided in Section 4.3.1, “Part Numbers

Fully Addressed by This Document.”

4.3.1

Part Numbers Fully Addressed by This Document

Table 63 provides the Freescale part numbering nomenclature for the MPC8610. Note that the individual part numbers

correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office. In

addition to the processor frequency, the part numbering scheme also includes an application modifier which may specify special

application conditions. Each part number also contains a revision code which refers to the die mask revision number.

Table 64 shows the parts that are available for ordering and their operating conditions.

Table 63. Part Numbering Nomenclature

nnnn

yyyy

Product

Code

Part

Identifier

Temp 3

Package 1

Core Processor

Frequency2

(MHz)

DDR speed

(MHz)

Product Revision Level

8610

T = –40 to

105

°C

PX = Leaded sphere

FC-PBGA

VT = RoHS lead free

FC-PBGA

1067, 800

J = 533 MHz

G = 400 MHz

Revision B = 1.1

System Version Register

Value for Rev B:

0x80A0_0011—MPC8610

Blank = 0

to 105

°C

1333, 1067, 800

Notes:

1. See Section 4, “Package Information,” for more information on available package types.

2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this

specification support all core frequencies. Additionally, parts addressed by part number specifications may support other

maximum core frequencies.

3. Extended temperature range devices are offered only with core frequencies of 1067 and 800 MHz.

Table 64. Part Offerings and Operating Conditions

Part Offerings1

Operating Conditions

MC8610xx1333Jz

Max CPU speed = 1333 MHz,

Max DDR = 533 MHz

MC8610xx1066Jz

Max CPU speed = 1066 MHz,

Max DDR = 533 MHz

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