MPC8610EC datasheet(89/96 Pages) FREESCALE

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Hardware Design Considerations

MPC8610 Integrated Host Processor Hardware Specifications, Rev. 0

Freescale Semiconductor

Figure 57. MPC8610 Thermal Model

3.14.5

Temperature Diode

The MPC8610 has a temperature diode on the microprocessor that can be used in conjunction with other system temperature

monitoring devices (such as Analog Devices, ADT7461™). These devices use the negative temperature coefficient of a diode

operated at a constant current to determine the temperature of the microprocessor and its environment. For proper operation,

the monitoring device used should auto-calibrate the device by canceling out the VBE variation of each MPC8610’s internal

diode.

The following are the specifications of the MPC8610 on-board temperature diode:

Vf > 0.40 V

Vf < 0.90 V

Operating range 2–300

μA

Diode leakage < 10 nA @ 125

°C

An approximate value of the ideality may be obtained by calibrating the device near the expected operating temperature.

Ideality factor is defined as the deviation from the ideal diode equation:

Bump and Underfill

Die

Substrate

Solder/Air

Die

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Die (8.5 x 9.7 x 0.86mm)

Silicon

Temperature

dependent

Bump and Underfill (8.5

× 9.7 × 0.07 mm)

Collapsed Resistance

8.1

W/(m • K)

Substrate (29

× 29 × 1.18 mm)

23.3

W/(m • K)

23.3

0.95

Solder and Air (29

× 29 × 0.4 mm)

0.034

W/(m • K)

0.034

12.1

Ifw = Is e

– 1

qVf

___

nKT

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