MPC8610EC datasheet(90/96 Pages) FREESCALE

90 / 96 page

MPC8610 Integrated Host Processor Hardware Specifications, Rev. 0

Package Information

Freescale Semiconductor

Another useful equation is:

Where:

Ifw = Forward current

Is = Saturation current

Vd = Voltage at diode

Vf = Voltage forward biased

VH = Diode voltage while IH is flowing

VL = Diode voltage while IL is flowing

IH = Larger diode bias current

IL = Smaller diode bias current

q = Charge of electron (1.6

× 10 –19 C)

n = Ideality factor (normally 1.0)

K = Boltzman’s constant (1.38

× 10–23 Joules/K)

T = Temperature (Kelvins)

The ratio of IH to IL is usually selected to be 10:1. The above simplifies to the following:

Solving for T, the equation becomes:

Package Information

This section details package parameters and dimensions.

4.1

Package Parameters for the MPC8610

The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 pins. There are two

package options: leaded flip chip-plastic ball grid array (FC-PBGA) and RoHS lead-free (FC-PBGA).

Die size

8.5 mm × 9.7 mm

Package outline

29 mm × 29 mm

Interconnects

783

Pitch

1 mm

Minimum module height

2.18 mm

Maximum module height

2.7 mm

Total capacitor count

23 caps; 100 nF each

For leaded FC-CBGA (package option: PX)

Solder balls

63% Sn 37% Pb

Ball diameter (typical)

0.50 mm

For RoHS lead-free FC-CBGA (package option: VT)

Solder balls

96.5% Sn, 3.5% Ag

Ball diameter (typical)

0.50 mm

VH – VL = n

VH – VL = 1.986 × 10

–4 × nT

nT =

VH – VL

__________

1.986

× 10–4

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