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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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DP83867CSRGZR.B датащи(PDF) 115 Page - Texas Instruments |
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DP83867CSRGZR.B датащи(HTML) 115 Page - Texas Instruments |
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115 / 129 page  8.4.1.5 PCB Layer Stacking To meet signal integrity and performance requirements, at minimum a 4-layer PCB can be used. However a 6- layer board is recommended. See Figure 8-12 for the recommended layer stack ups for 4, 6 and 8-layer boards. These are recommendations not requirements, other configurations can be used as per system requirements. Figure 8-12. Recommended Layer Stack Up Within a PCB, a desirabled can be to run traces using different methods, microstrip vs. stripline, depending on the location of the signal on the PCB. For example, the opportunity can be desirable to change layer stacking where an isolated chassis ground plane is used. Figure 8-13 illustrates alternative PCB stacking options. Figure 8-13. Alternative Layer Stack Up www.ti.com DP83867CS, DP83867IS, DP83867E SNLS504F – OCTOBER 2015 – REVISED JANUARY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 115 Product Folder Links: DP83867CS DP83867IS DP83867E |
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