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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SC16C852LIB датащи(PDF) 56 Page - NXP Semiconductors |
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SC16C852LIB датащи(HTML) 56 Page - NXP Semiconductors |
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56 / 60 page  SC16C852L_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 25 January 2007 56 of 60 NXP Semiconductors SC16C852L 1.8 V dual UART with 128-byte FIFOs and IrDA encoder/decoder 12.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 32) than a PbSn process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 41 and 42 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 32. Table 41. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 42. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 |
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