HC705C9AGRSSLASHD datasheet(149/157 Pages) NXP

номер детали	HC705C9AGRS/D

подробное описание детали	General Release Specification

PDF	157 Pages

Scroll/Zoom	100%

производитель	NXP [NXP Semiconductors]

домашняя страница	http://www.nxp.com

Logo

149 / 157 page

MC68HC705C9A — Rev. 2.0

Ordering Information

General Release Specification — MC68HC705C9A

Section 14. Ordering Information

14.1 Contents

14.2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149

14.3

MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149

14.2 Introduction

This section contains ordering information for the available package

types.

14.3 MC Order Numbers

Table 14-1 shows the MC order numbers for the available package

types.

Table 14-1. MC Order Numbers

Package Type

Temperature

Range

Order Number

40-Pin Plastic Dual In-Line Package (DIP)

–40

°C to 85°C

MC68HC705C9ACP

42-Pin Shrink Dual In-Line Package (SDIP)

–40

°C to 85°C

MC68HC705C9ACB

44-Lead Plastic Leaded Chip Carrier (PLCC)

–40

°C to 85°C

MC68HC705C9ACFN

44-Pin Quad Flat Pack (QFP)

–40

°C to 85°C

MC68HC705C9ACFB

NOTES:

1. P = Plastic dual in-line package (PDIP)

2. B = Shrink dual in-line package (SDIP)

3. FN = Plastic-leaded chip carrier (PLCC)

4. FB = Quad flat pack (QFP)

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

HC705C9AGRS/D датащи(PDF) 149 Page - NXP Semiconductors

HC705C9AGRS/D датащи(HTML) 149 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

датащи скачать

ссылки URL