| поискавой системы для электроныых деталей |
|
HC705C9AGRS/D датащи(PDF) 147 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
HC705C9AGRS/D датащи(HTML) 147 Page - NXP Semiconductors |
|
147 / 157 page ![]() General Release Specification 44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02) MC68HC705C9A — Rev. 2.0 Mechanical Specifications 13.5 44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02) Figure 13-3. 44-Lead PLCC (Case 777-02) -N- -L- -M- D Y D K V W 1 44 BRK B Z U X VIEW D-D S L-M M 0.007(0.180) N S T S L-M M 0.007(0.180) N S T G1 S L-M S 0.010 (0.25) N S T K1 F H S L-M M 0.007(0.180) N S T Z G G1 R A E J VIEW S C S L-M M 0.007(0.180) N S T S L-M M 0.007(0.180) N S T 0.004 (0.10) -T- SEATING PLANE VIEW S DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.685 0.695 17.40 17.65 B 0.685 0.695 17.40 17.65 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 0.51 K 0.025 0.64 R 0.650 0.656 16.51 16.66 U 0.650 0.656 16.51 16.66 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y 0.020 0.50 Z 2 ° 10 ° G1 0.610 0.630 15.50 16.00 K1 0.040 1.02 S L-M S 0.010 (0.25) N S T S L-M M 0.007(0.180) N S T 2 ° 10 ° NOTES: 1. DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOLDERS EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSION R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETER- MINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF THE MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMINSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTUSION(S) SHALL NOT CAUSE THE H DIMINSION TO BE GREATER THAN 0.037 (0.940148). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMINISION TO SMALLER THAN 0.025 (0.635). Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |