LPC2917SLASH01 datasheet(86/86 Pages) NXP

86 / 86 page

NXP Semiconductors

LPC2917/01; LPC2919/01

ARM9 microcontroller with CAN and LIN

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 June 2009

Document identifier: LPC2917_19_01_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

6.15.1

Clock description . . . . . . . . . . . . . . . . . . . . . . 46

6.15.2

Clock Generation Unit (CGU0) . . . . . . . . . . . . 47

6.15.2.1

Functional description. . . . . . . . . . . . . . . . . . . 47

6.15.2.2

PLL functional description . . . . . . . . . . . . . . . 50

6.15.2.3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . 51

6.15.3

Clock generation for CLK_OUT (CGU1). . . . . 51

6.15.3.1

Pin description . . . . . . . . . . . . . . . . . . . . . . . . 52

6.15.4

Reset Generation Unit (RGU). . . . . . . . . . . . . 52

6.15.4.1

Functional description. . . . . . . . . . . . . . . . . . . 52

6.15.4.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . 53

6.15.5

Power Management Unit (PMU) . . . . . . . . . . . 53

6.15.5.1

Functional description. . . . . . . . . . . . . . . . . . . 54

6.16

Vectored Interrupt Controller (VIC) . . . . . . . . . 56

6.16.1

Functional description. . . . . . . . . . . . . . . . . . . 56

6.16.2

Clock description . . . . . . . . . . . . . . . . . . . . . . 57

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 58

Static characteristics. . . . . . . . . . . . . . . . . . . . 60

8.1

Power consumption . . . . . . . . . . . . . . . . . . . . 64

8.2

Electrical pin characteristics . . . . . . . . . . . . . . 66

Dynamic characteristics . . . . . . . . . . . . . . . . . 68

9.1

Dynamic characteristics: I/O pins,

internal clock, oscillators, PLL,

and CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

9.2

Dynamic characteristics: I2C-bus

interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

9.3

Dynamic characteristics: SPI . . . . . . . . . . . . . 70

9.4

Dynamic characteristics:

ﬂash memory and EEPROM. . . . . . . . . . . . . . 71

9.5

Dynamic characteristics:

external static memory . . . . . . . . . . . . . . . . . . 72

9.6

Dynamic characteristics:

ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Application information. . . . . . . . . . . . . . . . . . 74

10.1

Operating frequency selection . . . . . . . . . . . . 74

10.2

SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 75

10.3

XIN_OSC input . . . . . . . . . . . . . . . . . . . . . . . . 77

10.4

XIN_OSC Printed Circuit Board

(PCB) layout guidelines . . . . . . . . . . . . . . . . . 77

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 78

Soldering of SMD packages . . . . . . . . . . . . . . 79

12.1

Introduction to soldering . . . . . . . . . . . . . . . . . 79

12.2

Wave and reﬂow soldering . . . . . . . . . . . . . . . 79

12.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 79

12.4

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 80

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 82

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 83

Legal information. . . . . . . . . . . . . . . . . . . . . . . 84

16.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 84

16.2

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

16.3

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 84

16.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Contact information . . . . . . . . . . . . . . . . . . . . 84

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

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