XIO2001IPNP datasheet(28/145 Pages) TI2

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Table 8-2. XIO2001/PCI Express Device Pin Connection Details

PIN NAME

COMMENTS

XIO2001

UPSTREAM PCI

EXPRESS DEVICE

TXP

RXP

XIO2001's transmit positive differential pin connects to the upstream device's receive

positive differential pin.

TXN

RXN

XIO2001's transmit positive differential pin connects to the upstream device's receive

negative differential pin.

RXP

TXP

XIO2001's transmit positive differential pin connects to the upstream device's receive

positive differential pin.

RXN

TXN

XIO2001's transmit positive differential pin connects to the upstream device's receive

negative differential pin.

The XIO2001 TXP and TXN terminals comprise a low-voltage, 100- Ω differentially driven signal pair. The RXP

and RXN terminals for the XIO2001 receive a low-voltage, 100- Ω differentially driven signal pair. The XIO2001

has integrated 50- Ω termination resistors to VSS on both the RXP and RXN terminals eliminating the need for

external components.

Each lane of the differential signal pair must be ac-coupled. The recommended value for the series capacitor is

0.1 μF. To minimize stray capacitance associated with the series capacitor circuit board solder pads, 0402-sized

capacitors are recommended.

When routing a 2.5-Gb/s low-voltage, 100- Ω differentially driven signal pair, the following circuit board design

guidelines must be considered:

1. The PCI-Express drivers and receivers are designed to operate with adequate bit error rate margins over a

20 ” maximum length signal pair routed through FR4 circuit board material.

2. Each differential signal pair must be 100- Ω differential impedance with each single-ended lane measuring in

the range of 50 Ω to 55 Ω impedance to ground.

3. The differential signal trace lengths associated with a PCI Express high-speed link must be length matched to

minimize signal jitter. This length matching requirement applies only to the P and N signals within a

differential pair. The transmitter differential pair does not need to be length matched to the receiver differential

pair. The absolute maximum trace length difference between the TXP signal and TXN signal must be less

than 5 mils. This also applies to the RXP and RXN signal pair.

4. If a differential signal pair is broken into segments by vias, series capacitors, or connectors, the length of the

positive signal trace must be length matched to the negative signal trace for each segment. Trace length

differences over all segments are additive and must be less than 5 mils.

5. The location of the series capacitors is critical. For add-in cards, the series capacitors are located between

the TXP/TXN terminals and the PCI-Express connector. In addition, the capacitors are placed near the PCI

Express connector. This translates to two capacitors on the motherboard for the downstream link and two

capacitors on the add-in card for the upstream link. If both the upstream device and the downstream device

reside on the same circuit board, the capacitors are located near the TXP/TXN terminals for each link.

6. The number of vias must be minimized. Each signal trace via reduces the maximum trace length by

approximately 2 inches. For example: if 6 vias are needed, the maximum trace length is 8 inches.

7. When routing a differential signal pair, 45 degree angles are preferred over 90 degree angles. Signal trace

length matching is easier with 45-degree angles and overall signal trace length is reduced.

8. The differential signal pairs must not be routed over gaps in the power planes or ground planes. This causes

impedance mismatches.

9. If vias are used to change from one signal layer to another signal layer, it is important to maintain the same

50- Ω impedance reference to the ground plane. Changing reference planes causes signal trace impedance

mismatches. If changing reference planes cannot be prevented, bypass capacitors connecting the two

reference planes next to the signal trace vias will help reduce the impedance mismatch.

10.If possible, the differential signal pairs must be routed on the top and bottom layers of a circuit board. Signal

propagation speeds are faster on external signal layers.

XIO2001

SCPS212J – MAY 2009 – REVISED JANUARY 2021

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