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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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XIO2001IPNP датащи(PDF) 16 Page - Texas Instruments |
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XIO2001IPNP датащи(HTML) 16 Page - Texas Instruments |
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16 / 145 page  6.4 Thermal Information (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PNP θJA Junction-to-free-air thermal resistance Low-K JEDEC test board, 1s (single signal layer), no air flow 50.8 °C/W High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow 24.9 θJC Junction-to-case thermal resistance Cu cold plate measurement process 18.9 °C/W θJB Junction-to-board thermal resistance EIA/JESD 51-8 14.6 °C/W ψJT Junction-to-top of package EIA/JESD 51-2 0.26 °C/W ψJB Junction-to-board EIA/JESD 51-6 7.93 °C/W TA Operating ambient temperature range XIO2001PNP 0 70 °C XIO2001IPNP –40 85 TJ Virtual junction temperature XIO2001PNP 0 105 °C XIO2001IPNP –40 105 ZAJ θJA Junction-to-free-air thermal resistance Low-K JEDEC test board, 1s (single signal layer), no air flow 82 °C/W High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow 58.8 θJC Junction-to-case thermal resistance Cu cold plate measurement process 19 °C/W θJB Junction-to-board thermal resistance EIA/JESD 51-8 32 °C/W ψJT Junction-to-top of package EIA/JESD 51-2 0.5 °C/W ψJB Junction-to-board EIA/JESD 51-6 30 °C/W TA Operating ambient temperature range XIO2001ZAJ 0 70 °C XIO2001IZAJ –40 85 TJ Virtual junction temperature XIO2001ZAJ 0 105 °C XIO2001IZAJ –40 105 ZWS θJA Junction-to-free-air thermal resistance High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow 36.2 °C/W θJC Junction-to-case thermal resistance Cu cold plate measurement process 18.3 °C/W θJB Junction-to-board thermal resistance EIA/JESD 51-8 20.3 °C/W ψJT Junction-to-top of package EIA/JESD 51-2 0.4 °C/W ψJB Junction-to-board EIA/JESD 51-6 20.1 °C/W TA Operating ambient temperature range XIO2001ZWS 0 70 °C XIO2001IZWS –40 85 TJ Virtual junction temperature XIO2001ZWS 0 105 °C XIO2001IZWS –40 105 (1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953). 6.5 Nominal Power Consumption DEVICES POWER STATE(1) VOLTS AMPERES WATTS No downstream PCI devices D0 idle 1.5 0.147 0.221 3.3 0.062 0.205 TOTALS: 0.209 0.426 XIO2001 SCPS212J – MAY 2009 – REVISED JANUARY 2021 www.ti.com 16 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: XIO2001 |
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