HC705C9AGRSSLASHD datasheet(132/157 Pages) NXP

номер детали	HC705C9AGRS/D

подробное описание детали	General Release Specification

PDF	157 Pages

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производитель	NXP [NXP Semiconductors]

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General Release Speciﬁcation

Power Considerations

MC68HC705C9A — Rev. 2.0

Electrical Specifications

12.5 Power Considerations

The average chip-junction temperature, T

J, in °C, can be obtained from:

J = TA + (PD × θJA)

(1)

where:

A = Ambient temperature, °C

JA = Package thermal resistance, junction to ambient, °C/W

D = PINT + PI

INT = IDD × VDD watts (chip internal power)

/O = Power dissipation on input and output pins (user determined)

For most applications P

/O « PINT and can be neglected.

The following is an approximate relationship between P

D and TJ

(neglecting P

J):

D = K ÷ (TJ + 273 °C)

(2)

Solving equations (1) and (2) for K gives:

K = P

D × (TA + 273 °C) + θJA × (PD)

(3)

where K is a constant pertaining to the particular part. K can be

determined from equation (3) by measuring P

D (at equilibrium) for a

known T

A. Using this value of K, the values of PD and TJ can be obtained

by solving equations (1) and (2) iteratively for any value of T

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

HC705C9AGRS/D датащи(PDF) 132 Page - NXP Semiconductors