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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8560CPX667JC датащи(PDF) 90 Page - NXP Semiconductors |
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MPC8560CPX667JC датащи(HTML) 90 Page - NXP Semiconductors |
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90 / 108 page  MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2 90 Freescale Semiconductor Thermal The spring mounting should be designed to apply the force only directly above the die. By localizing the force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the package. Figure 56 and Figure 57 provide exploded views of the plastic fence, heat sink, and spring clip. Figure 56. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force |
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