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MPC8560CPX667JC датащи(PDF) 20 Page - NXP Semiconductors

номер детали MPC8560CPX667JC
подробное описание детали  Integrated Processor Hardware Specifications
PDF  108 Pages
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производитель  NXP [NXP Semiconductors]
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MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
20
Freescale Semiconductor
DDR SDRAM
6.2.2 DDR SDRAM Output AC Timing Specifications
For chip selects MCS1 and MCS2, there will always be at least 200 DDR memory clocks coming out of
self-refresh after an HRESET before a precharge occurs. This will not necessarily be the case for chip
selects MCS0 and MCS3.
6.2.2.1
DLL Enabled Mode
Table 16 and Table 17 provide the output AC timing specifications and measurement conditions for the
DDR SDRAM interface with the DDR DLL enabled.
Table 16. DDR SDRAM Output AC Timing Specifications–DLL Mode
At recommended operating conditions with GVDD of 2.5 V ± 5%.
Parameter
Symbol 1
Min
Max
Unit
Notes
MCK[n] cycle time, (MCK[n]/MCK[n] crossing)
tMCK
610
ns
2
On chip Clock Skew
tMCKSKEW
—
150
ps
3, 8
MCK[n] duty cycle
tMCKH/tMCK
45
55
%
8
ADDR/CMD output valid
tDDKHOV
—3
ns
4, 9
ADDR/CMD output invalid
tDDKHOX
1—
ns
4, 9
Write CMD to first MDQS capture edge
tDDSHMH
tMCK + 1.5
tMCK + 4.0
ns
5
MDQ/MECC/MDM output setup with respect to
MDQS
333 MHz
266 MHz
200 MHz
tDDKHDS,
tDDKLDS
900
1100
1200
—ps
6, 9
MDQ/MECC/MDM output hold with respect to
MDQS
333 MHz
266 MHz
200 MHz
tDDKHDX,
tDDKLDX
900
1100
1200
—ps
6, 9
MDQS preamble start
tDDSHMP
0.75
× tMCK + 1.5
0.75
× tMCK + 4.0
ns
7, 8



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