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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8560CPX667JC датащи(PDF) 82 Page - NXP Semiconductors |
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MPC8560CPX667JC датащи(HTML) 82 Page - NXP Semiconductors |
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82 / 108 page  MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2 82 Freescale Semiconductor Thermal 15.4 Frequency Options Table 59 shows the expected frequency values for the platform frequency when using a CCB to SYSCLK ratio in comparison to the memory bus speed. 16 Thermal This section describes the thermal specifications of the MPC8560. 16.1 Thermal Characteristics Table 60 provides the package thermal characteristics for the MPC8560. Table 59. Frequency Options with Respect to Memory Bus Speeds CCB to SYSCLK Ratio SYSCLK (MHz) 16.67 25 33.33 41.63 66.67 83 100 111 133.33 Platform/CCB Frequency (MHz) 2 200 222 267 3 200 250 300 333 4 267 333 5 208 333 6 200 250 8 200 267 333 9 225 300 10 250 333 12 200 300 16 267 Table 60. Package Thermal Characteristics Characteristic Symbol Value Unit Notes Junction-to-ambient Natural Convection on four layer board (2s2p) RθJMA 16 °C/W 1, 2 Junction-to-ambient (@100 ft/min or 0.5 m/s) on four layer board (2s2p) RθJMA 14 °C/W 1, 2 Junction-to-ambient (@200 ft/min or 1 m/s) on four layer board (2s2p) RθJMA 12 °C/W 1, 2 Junction-to-board thermal RθJB 7.5 °C/W 3 |
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