MPC8560CPX667JC datasheet(84/108 Pages) NXP

84 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Thermal

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Millennium Electronics (MEI)

408-436-8770

Loroco Sites

671 East Brokaw Road

San Jose, CA 95112

Internet: www.mei-millennium.com

Tyco Electronics

800-522-6752

Chip Coolers™

P.O. Box 3668

Harrisburg, PA 17105-3668

Internet: www.chipcoolers.com

Wakefield Engineering

603-635-5102

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal

performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several

heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,

and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the

MPC8560 to function in various environments.

16.2.1 Recommended Thermal Model

For system thermal modeling, the MPC8560 thermal model is shown in Figure 52. Five cuboids are used

to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block

29x29x1.47 mm with the conductivity adjusted accordingly. For modeling, the planar dimensions of the

die are rounded to the nearest mm, so the die is modeled as 10x12 mm at a thickness of 0.76 mm. The

bump/underfill layer is modeled as a collapsed resistance between the die and substrate assuming a

conductivity of 0.6 in-plane and 1.9 W/m•K in the thickness dimension of 0.76 mm. The lid attach

adhesive is also modeled as a collapsed resistance with dimensions of 10x12x0.050 mm and the

conductivity of 1 W/m•K. The nickel plated copper lid is modeled as 12x14x1 mm. Note that the die and

lid are not centered on the substrate; there is a 1.5 mm offset documented in the case outline drawing in

Figure 50.

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