MPC8560CPX667JC datasheet(24/108 Pages) NXP

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MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Ethernet: Three-Speed, MII Management

7.2 GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications

The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.

7.2.1 GMII AC Timing Specifications

This section describes the GMII transmit and receive AC timing specifications.

7.2.1.1

GMII Transmit AC Timing Specifications

Table 21 provides the GMII transmit AC timing specifications.

Table 20. GMII, MII, RGMII, RTBI, and TBI DC Electrical Characteristics

Parameters

Symbol

Min

Max

Unit

Supply voltage 2.5 V

LVDD

2.37

2.63

Output high voltage (LVDD = Min, IOH = –1.0 mA)

VOH

2.00

LVDD + 0.3

Output low voltage (LVDD = Min, IOL = 1.0 mA)

VOL

GND – 0.3

0.40

Input high voltage

VIH

1.70

LVDD + 0.3

Input low voltage

VIL

–0.3

0.70

Input high current (VIN

1 = LV

DD)IIH

—10

μA

Input low current (VIN

1 = GND)

IIL

–15

—

μA

Note:

1.Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 1and Table 2.

Table 21. GMII Transmit AC Timing Specifications

At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.

Parameter/Condition

Symbol 1

Min

Typ

Max

Unit

GTX_CLK clock period

tGTX

—8.0

—

GTX_CLK duty cycle

tGTXH/tGTX

—

GMII data TXD[7:0], TX_ER, TX_EN setup time

tGTKHDV

2.5

—

GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay

tGTKHDX

0.5

—

5.0

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