MPC8560CPX667JC datasheet(83/108 Pages) NXP

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MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Thermal

16.2 Thermal Management Information

This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)

package for air-cooled applications. Proper thermal control design is primarily dependent on the

system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment

method to the heat sink is illustrated in Figure 51. The heat sink should be attached to the printed-circuit

board with the spring force centered over the die. This spring force should not exceed 10 pounds force.

Figure 51. Package Exploded Cross-Sectional View with Several Heat Sink Options

The system board designer can choose between several types of heat sinks to place on the MPC8560. There

are several commercially-available heat sinks from the following vendors:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Junction-to-case thermal

RθJC

0.8

°C/W

Notes

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and

board thermal resistance

2. Per JEDEC JESD51-6 with the board horizontal.

3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal

resistance of the interface layer.

Table 60. Package Thermal Characteristics (continued)

Characteristic

Symbol

Value

Unit

Notes

Thermal Interface Material

Heat Sink

FC-PBGA Package

Heat Sink

Clip

Printed-Circuit Board

Die

Lid

Adhesive or

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