ISM330DLC datasheet(15/116 Pages) STMICROELECTRONICS

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ISM330DLC

Overview

116

Overview

The ISM330DLC is a system-in-package featuring a high-performance 3D digital

accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

The ISM330DLC has a full-scale acceleration range of ±2/±4/±8/±16 g, an angular rate

range of ±125/±250/±500/±1000/±2000 dps and is capable of delivering highly accurate and

reliable measurements at an ultra-low power consumption (0.75 mA in high-performance,

combo mode).

The ISM330DLC embeds smart features which simplify and optimize the application design

and allows the usage of complex motion-sensing information also in power-constrained

applications

The event-detection interrupts enable efficient and reliable motion tracking and contextual

awareness, implementing hardware recognition of free-fall events, 6D orientation, click and

double-click sensing, activity or inactivity, and wakeup events.

Up to 4 kbyte of FIFO with dynamic allocation of significant data (i.e. external sensors,

timestamp, etc.) allows overall power saving of the system and protects against any loss of

data.

With the sensor hub feature, data from up to 4 external sensors can be collected and stored

in the internal FIFO without intervention of the application microcontroller.

Moreover, the ISM330DLC offers specific support, both for the gyroscope and the

accelerometer, to applications requiring closed control loop. The device, through a

dedicated auxiliary SPI interface and a configurable signal processing path having low

latency and low noise, can provide data for the control loop while, at the same time, a

second fully independent path can output data for other application intents.

Like the entire portfolio of MEMS sensor modules, the ISM330DLC leverages the robust

and mature in-house manufacturing processes already used for the production of

micromachined accelerometers and gyroscopes. The various sensing elements are

manufactured using specialized micromachining processes, while the IC interfaces are

developed using CMOS technology that allows the design of a dedicated circuit which is

trimmed to better match the characteristics of the sensing element.

In the ISM330DLC, the sensing element of the accelerometer and of the gyroscope are

implemented on the same silicon die, thus guaranteeing superior stability and robustness.

The ISM330DLC is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x

0.83 mm.

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