TMS320VC549 datasheet(55/111 Pages) TI

55 / 111 page

TMS320C54x, TMS320LC54x, TMS320VC54x

FIXED-POINT DIGITAL SIGNAL PROCESSORS

SPRS039C – FEBRUARY 1996 – REVISED DECEMBER 1999

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251–1443

device and development support tool nomenclature (continued)

PREFIX

TEMPERATURE RANGE

(’54x DEFAULT: –40

°C TO 100°C)

TMS 320

C 542 PGE (L)

TMX = experimental device

TMP = prototype device

TMS = qualified device

SMJ = MIL-STD-883C

SM = High Rel (non-883C)

DEVICE FAMILY

320 = TMS320 Family

TECHNOLOGY

H= 0

°C to 50°C

L= 0

°C to 70°C

S= – 55

°C to 100°C

M= – 55

°C to 125°C

A= – 40

°C to 85°C

PACKAGE TYPE†

= plastic DIP

= ceramic DIP

= ceramic DIP side-brazed

= ceramic PGA

= ceramic CC

= plastic leaded CC

= ceramic leadless CC

= 100-pin plastic EIAJ QFP

= 132-pin plastic bumpered QFP

= 100-pin plastic TQFP

PBK = 128-pin plastic TQFP

PGE = 144-pin plastic TQFP

GGU = 144-pin BGA

C = CMOS

E = CMOS EPROM

F = CMOS Flash EEPROM

LC = Low-Voltage CMOS (3.3 V)

VC = Low Voltage CMOS [3 V (2.5 V core)]

DEVICE

’1x DSP:

’2x DSP:

’2xx DSP:

203

206

240

204

209

’3x DSP:

’4x DSP:

’5x DSP:

’54x DSP:

541

545

542

546

543

548

549

’6x DSP:

6201

6701

(B)

BOOT-LOADER OPTION

† DIP = Dual-In-Line Package

PGA = Pin Grid Array

CC = Chip Carrier

QFP = Quad Flat Package

TQFP = Thin Quad Flat Package

Figure 10. TMS320 DSP Device Nomenclature

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