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TMPR4955AF датащи(PDF) 33 Page - Toshiba Semiconductor

номер детали TMPR4955AF
подробное описание детали  64-Bit TX System RISC TX49 Family
PDF  168 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMPR4955AF датащи(HTML) 33 Page - Toshiba Semiconductor

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3
General Safety Precautions and Usage Considerations
3-13
(1) Using a soldering iron
Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three
seconds for lead temperatures of up to 350°C.
(2) Using medium infrared ray reflow
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Long infrared ray heater (preheating)
Medium infrared ray heater
(reflow)
Product flow
Figure 3
Heating top and bottom with long or medium infrared rays
Complete the infrared ray reflow process within 30 seconds at a package surface temperature of
between 210°C and 240°C.
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
210
30 s
or less
Time (s)
60-120 s
(°C)
240
160
140
Figure 4
Sample temperature profile for infrared or hot air reflow
(3) Using hot air reflow
Complete hot air reflow within 30 seconds at a package surface temperature of between 210°C
and 240°C.
For an example of a recommended temperature profile, refer to Figure 4 above.
(4) Using solder flow
Apply preheating for 60 to 120 seconds at a temperature of 150°C.
For lead insertion-type packages, complete solder flow within 10 seconds with the
temperature at the stopper (or, if there is no stopper, at a location more than 1.5 mm from
the body) which does not exceed 260°C.



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