TMPR4955AF datasheet(35/168 Pages) TOSHIBA

35 / 168 page

General Safety Precautions and Usage Considerations

3-15

3.5.5

No cleaning

If analog devices or high-speed devices are used without being cleaned, flux residues may cause

minute amounts of leakage between pins. Similarly, dew condensation, which occurs in

environments containing residual chlorine when power to the device is on, may cause between-

lead leakage or migration. Therefore, Toshiba recommends that these devices be cleaned.

However, if the flux used contains only a small amount of halogen (0.05W% or less), the devices

may be used without cleaning without any problems.

3.5.6

Mounting tape carrier packages (TCPs)

(1) When tape carrier packages (TCPs) are mounted, measures must be taken to prevent

electrostatic breakdown of the devices.

(2) If devices are being picked up from tape, or outer lead bonding (OLB) mounting is being

carried out, consult the manufacturer of the insertion machine which is being used, in order

to establish the optimum mounting conditions in advance and to avoid any possible hazards.

(3) The base film, which is made of polyimide, is hard and thin. Be careful not to cut or scratch

your hands or any objects while handling the tape.

(4) When punching tape, try not to scatter broken pieces of tape too much.

(5) Treat the extra film, reels and spacers left after punching as industrial waste, taking care not

to destroy or pollute the environment.

(6) Chips housed in tape carrier packages (TCPs) are bare chips and therefore have their reverse

side exposed. To ensure that the chip will not be cracked during mounting, ensure that no

mechanical shock is applied to the reverse side of the chip. Electrical contact may also cause a

chip to fail. Therefore, when mounting devices, make sure that nothing comes into electrical

contact with the reverse side of the chip.

If your design requires connecting the reverse side of the chip to the circuit board, please

consult Toshiba or a Toshiba distributor beforehand.

3.5.7

Mounting chips

Devices delivered in chip form tend to degrade or break under external forces much more easily

than plastic-packaged devices. Therefore, caution is required when handling this type of device.

(1) Mount devices in a properly prepared environment so that chip surfaces will not be exposed to

polluted ambient air or other polluted substances.

(2) When handling chips, be careful not to expose them to static electricity.

In particular, measures must be taken to prevent static damage during the mounting of chips.

With this in mind, Toshiba recommend mounting all peripheral parts first and then mounting

chips last (after all other components have been mounted).

(3) Make sure that PCBs (or any other kind of circuit board) on which chips are being mounted do

not have any chemical residues on them (such as the chemicals which were used for etching

the PCBs).

(4) When mounting chips on a board, use the method of assembly that is most suitable for

maintaining the appropriate electrical, thermal and mechanical properties of the

semiconductor devices used.

* For details of devices in chip form, refer to the relevant device’s individual datasheets.

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