DA16200 datasheet(146/154 Pages) RENESAS

146 / 154 page

DA16200

Ultra Low Power Wi-Fi SoC

Datasheet

Revision 3.6

04-Jan-2023

CFR0011-120-00

146 of 153

12.7 Soldering Information

12.7.1

Recommended Condition for Reflow Soldering

Figure 77 shows the typical process flow to install surface mount packages to the PCB.

The reflow profile depends on the solder paste being used and the recommendations from the paste

manufacturer should be followed to determine the proper reflow profile. Figure 77 shows a typical

reflow profile when a no-clean paste is used. Oven time above liquidus (260 °C for lead-free solder)

is 30 to 60 seconds.

Since solder joints are not exposed in QFN packages, any retouch is not possible and the whole

package has to be removed if the surface mount process results in shorts or opens. Furthermore,

rework of QFN packages can be a challenge due to their small size. In most applications, QFNs will

be installed on smaller, thinner, and denser PCBs, and introduces further challenges due to handling

and heating issues. Since reflow of adjacent parts is not desirable during rework, the proximity of

other components may further complicate this process. Because of the product dependent

complexities, the following steps only provide a guideline and a starting point for the development of

a successful rework process for the QFN packages.

The rework process involves the following steps:

1. Component removal

2. Site redress

3. Solder paste application

4. Component placement

5. Component attachment

Figure 77: Typical PCB Mounting Process Flow

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