General Description
The DA16200 is a highly integrated ultra-low power Wi-Fi system on a chip (SoC), which contains an
802.11b/g/n radio (PHY), a baseband processor, a media access controller (MAC), on-chip memory,
and a host networking application processor, all on a single silicon die.
The SoC enables full offload capabilities, running the entire networking stack on chip so that no
external network processor, CPU, or microcontroller is required, while many other SoCs optionally
use a microcontroller.
DA16200 is a synthesis of breakthrough ultra-low power technologies that enables extremely low
power operation in the SoC. DA16200 shuts down every micro element of the chip that is not in use,
which allows a near zero level of power consumption when not actively transmitting or receiving data.
Such low power operation can extend the battery life up to a year or more depending on the
application. DA16200 also enables ultra-low power transmitting and receiving modes when the SoC
needs to be awake to exchange information with other devices. Advanced algorithms enable staying
asleep until the exact moment required to wake up to transmit or receive.
The SoC is built from the ground up for the Internet of Things (IoT) and is ideal for door locks,
thermostats, sensors, pet trackers, asset trackers, sprinkler systems, connected lighting, video
cameras, video doorbells, wearables, and other IoT devices.

Key Features
■ Highly integrated ultra-low power Wi-Fi®
system on chip
■ Full offload: SoC runs full networking OS and
TCP/IP stack
■ Wi-Fi processor
□ IEEE 802.11b/g/n, 1×1, 20 MHz channel
bandwidth, 2.4 GHz
□ IEEE 802.11s Wi-Fi mesh
□ On-chip PA, LNA, and RF switch
□ Wi-Fi security: WPA/WPA2-
Enterprise/Personal, WPA2 SI, WPA3
SAE, and OWE
□ Vendor EAP types: EAPTTLS/MSCHAPv2, PEAPv0/EAPMSCHAPv2, PEAPv1, EAP-FAST, and
EAP-TLS
□ Operating modes: Station, SoftAP, and
Wi-Fi Direct® Modes (GO, GC, GO fixed)
□ WPS-PIN/PBC for easy Wi-Fi provisioning
□ Connection manager for autonomous and
fast Wi-Fi connections
□ Bluetooth coexistence
□ Antenna switching diversity
■ Built-in 4-channel auxiliary ADC for sensor
interfaces
□ 12-bit SAR ADC: single-ended four
channels
■ Direct code execution from the external serial
flash memory (XIP)
□ Provides dynamic auto switching function
■ Supports various interfaces
□ eMMC/SD expanded memory
□ SDIO Host/Slave function
□ QSPI for external flash control
□ Three UARTs
□ SPI Master/Slave interface
□ I2C Master/Slave interface
□ I2S for digital audio streaming
□ 4-channel PWM
□ Individually programmable, multiplexed
GPIO pins
□ JTAG and SWD
■ Wi-Fi Alliance certifications:
□ Wi-Fi CERTIFIED™ b, g, n
□ WPA™ - Enterprise, Personal
□ WPA2™ - Enterprise, Personal
□ WPA3™ - Enterprise, Personal
□ Wi-Fi Direct
□ Wi-Fi Enhanced Open™
□ WMM
□ WMM - Power Save
□ Wi-Fi Protected Setup™
■ CPU core subsystem
□ Arm® Cortex®-M4F core w/ clock
frequency of 30~160 MHz
□ ROM: 256 kB
■ Hardware accelerators
□ General HW CRC engine
□ HW zeroing function for fast booting
□ Pseudo random number generator
(PRNG)
■ Complete software stack
□ Comprehensive networking software stack
□ Provides TCP/IP stack: in the form of
network socket APIs
■ Advanced security
□ Secure booting
□ Secure debugging using JTAG/SWD and
UART ports
□ Secure asset storage
■ Built-in hardware crypto engines for advanced
security
□ TLS/DTLS security protocol functions
□ Crypto engine for key deliberate generic
security functions: AES (128,192,256),
DES/3DES, SHA1/224/256, RSA, DH,
ECC, CHACHA, and TRNG
□ SRAM: 512 kB
□ OTP: 2 kB
□ Retention Memory: 48 kB
■ Power management unit
□ On-Chip RTC
□ Wake-up control of fast booting or full
booting with minimal initialization time
□ Integrated DC-DC and LDOs
□ Supports three ultra-low power Sleep
modes
■ Clock source
□ 40 MHz crystal (± 20 ppm) for master
clock (initial + temp + aging)
□ 32.768 kHz crystal (± 250 ppm) for RTC
clock
□ Integrated 32 kHz RC oscillator
■ Supply
□ Single operating voltage: 2.1 V to 3.6 V
(typical: 3.3 V)
□ Digital I/O Supply Voltage: 1.8 V / 3.3 V
□ Black-out and brown-out detector
■ Package type
□ 6 mm × 6 mm, 0.4 mm pitch, 48-Pin, QFN
□ 3.8 mm × 3.8 mm, 0.4 mm pitch, 72-Pin,
fcCSP
■ Operating temperature range
□ -40 °C to 85 °C